Wide-bandwidth millimeter-wave bond-wire interconnects

Budka, T.P.

doi:10.1109/22.915447

Cited by 81 publications

(25 citation statements)

References 1 publication

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“…In addition, it has the advantage of being tolerant on die and package thermal expansion, an important requirement for many applications. There are methods to compensate the discontinuity on either or both sides of the die and package for millimetre-wave applications [20,21].…”

Section: Design Considerationsmentioning

confidence: 99%

A COMPACT PACKAGE WITH INTEGRATED PATCH ANTENNA FOR SINGLE-CHIP 60-GHz RADIOS

Wai¹,

Chua²,

Lu³

et al. 2011

PIER C

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Abstract-This paper presents the development of a standard surface mountable ceramic ball grid array (CBGA) package with an integrated patch antenna in low temperature cofired ceramic (LTCC) technology for emerging single-chip 60-GHz radios. It addresses the challenges of low-loss wire bonding interconnections required between the chip and the antenna as well as the package to allow efficient utilization of available space for miniaturization. The compact package of size 12.5×8×1.265 mm 3 achieves good electrical performance. For instance, the package part exhibits insertion loss < 0.08 dB, return loss > 22 dB, and attenuation rate < 0.2 dB/cm below 5 GHz; while the antenna part demonstrates 8-GHz impedance bandwidth and 8 ± 2 dBi peak realized gain at 60 GHz. Simulated and measured results are compared. They agree reasonably well, indicating the feasibility of designing and manufacturing the integrated antenna package in LTCC for millimeterwave applications.

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Section: Design Considerationsmentioning

confidence: 99%

A COMPACT PACKAGE WITH INTEGRATED PATCH ANTENNA FOR SINGLE-CHIP 60-GHz RADIOS

Wai¹,

Chua²,

Lu³

et al. 2011

PIER C

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“…Thus, it can provide a low input impedance and reduce the domi- nant effect of the input pole due to the large photodiode junction capacitance . The input pole frequency can be written as (17) where and are the input resistance and input capacitance, respectively. For the circuit in Fig.…”

Section: Example Designmentioning

confidence: 99%

“…Theoretical limits of gain-bandwidth product of lumped amplifiers have been known for over half a century [9]- [14]. Broad-band filter synthesis techniques for bandwidth enhancement has been used for wide-band amplifier [15], [16] and interconnect [17] design. Applying proper matching networks between amplifier stages to approach those limits is the key step in improving wide-band amplifiers bandwidth with this method.…”

Section: Introductionmentioning

confidence: 99%

Bandwidth enhancement for transimpedance amplifiers

Analui

Hajimiri

2004

IEEE J. Solid-State Circuits

177

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“…To improve the performance of wire bond interconnects and enable the use of longer bonding wires the design techniques applied to mm-wave frequencies focus on two main methods; the inclusion of low pass filters on chip (Budka, 2001) and design of specific compensation networks (Karnfelt at al., 2006). The first method requires the co-design of the chip and package, and it is not suitable for connecting a radio chip to the antenna when a DC blocking capacitor is required between them.…”

Section: Patch Array On Cmos Chipmentioning

confidence: 99%