Wideband Vertically-Interdigital-Capacitor

Broadband vertically interdigital‐capacitor with high frequency response improving

“…Comparison results between the proposed VIC and existing designs are summarized in Table 1. The overall performances of the proposed VIC exceed the performances of existing interdigital capacitors [7][8][9] in terms of bandwidth and capacitance increment. Bandwidth increment is achieved by reducing the number of stop-bands structures.…”

“…Placing the added interconnections and the I/O ports in the same direction 9 is easily resulting in reverse currents on adjacent broadside parallel lines and signal interference between the I/O port of each finger and the added via interconnection on each finger. Figure 3A,B shows the electromagnetic (EM)‐simulated current flow of VIC 9 from top view and three‐dimensional (3D) view, respectively. Figure 3C shows the reverse currents on adjacent broadside parallel lines.…”

“…A, Top view, B, 3D view, and C, current flow with arrows of current distribution in Ref. [9]; D, top view, E, 3D view, and F, current flow with arrows of current distribution of the proposed VIC [Color figure can be viewed at wileyonlinelibrary.com]…”

“…[5][6][7] Via interconnections inside fingers are proposed to remove the spurs, 8 but the clearance on fingers decrease the coupling area and may result in capacitance reducing. Via interconnections outside fingers are proposed, 9,10 however, the via interconnections 9 are installed at the input/output (I/O) ports, which may degrade the signal transmission performance.…”

Spur-Less Interdigital Metal-Insulator-Metal Capacitor

“…In Figure 1(d), the unexpected spurs at frequencies f 1 , f 2 , f 3 , f 4 , and f 5 can be noticed. Bond wire interconnections and via transitions have been adopted to remove the unexpected spurs of planar interdigital capacitors and vertically-interdigital-capacitors (VICs) [2][3][4][5][6]; however, the spur elimination for interdigital MIM capacitors has not been reported yet.…”