Wire-Bond Void Formation During High Temperature Aging

Chang, Hsihui; Hsieh, Ker-Chang; Martens, Theo; Yang, A.

doi:10.1109/tcapt.2004.825752

Cited by 39 publications

(7 citation statements)

References 9 publications

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“…1 Kirkendall voids were found by Uno to be caused by nonuniform intermetallic formation, 2 and such void formation is accepted as one of the actual causes of bond failures. 3 Corrosion is known to be a reaction between Au-Al intermetallic phases and molding compounds.…”

Section: Introductionmentioning

confidence: 99%

Bromine- and chlorine-induced degradation of gold-aluminum bonds

Lue

Huang

et al. 2004

Journal of Elec Materi

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The presence of bromine (Br) in flame retardant epoxies accelerates the degradation of gold-aluminum wire bonds. This experiment tests degradation by adding 5 wt.% 2,6-dibromophenol to the regular molding compound and holding thermal aging at 175°C and 205°C in ovens for up to 1,008 h. The intermetallic degrading microstructure was examined at different aging times. In order to better understand the mechanism behind the degradation, bulk Au 4 Al and Au 5 Al 2 single-intermetallic phases were prepared and reacted with molding compound at 205°C. The reactions were analyzed by a JEOL (Japan Electron Optics Ltd., Tokyo) Superprobe JXA-8900R under wavelength-dispersive spectrometry of x-ray mode. A similar chloride degrading study was performed by adding Tetrachlorobisphenol A to the regular molding compound. The results show that Br attacked the Au 4 Al phase first and then the Au 5 Al 2 phase. The chloride reacted with the Au 4 Al phase only.

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Section: Introductionmentioning

confidence: 99%

Bromine- and chlorine-induced degradation of gold-aluminum bonds

Lue

Huang

et al. 2004

Journal of Elec Materi

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“…The composition value of the Al is near to that of obtained Al percentage in the sectioned sample of Au aluminide. The mechanism of formation of aluminides in Au ball bonds is widely discussed in the literature [1][2][3]. The formation of the Au-rich or Al-rich phases depends on the time, temperature and thickness of the coating given.…”

Section: Ball Shear After the Wire-bonding Process And Imcmentioning

confidence: 99%

“…There are a few types of bond pad surfaces used for Au wire bonding in the market. Al is the most common one and its failure mechanisms have been studied extensively over past a few decades [1][2][3]. Au-coated Pd bond pad is one of bond pad surfaces used for Au wire bonding in recent years.…”

Section: Introductionmentioning

confidence: 99%

Plasma cleaning on bond pad surfaces for gold wire bonding

Reingruber

Mais

et al. 2009

2009 11th Electronics Packaging Technology Conference

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Ar plasma was employed to remove/reduce the oxidation of two typical types of bond pad surfaces, namely aluminum (Al) surface and gold (Au)-coated palladium (Pd) surface, prior to Au wire-bonding process. Field emission scanning electron microscopy (FESEM) and Auger electron spectroscopy (AES) were employed to characterize the bond pad surfaces without and with the plasma cleaning. Processability and reliability results were compared, analyzed and discussed. Although the plasma cleaning did not make significant change for either the Al bond pad surface or the Au-coated Pd bond pad surface in terms of surface morphology, it was found that the impacts of the plasma cleaning on the two types of bond pad surfaces were quite different. On the one hand, for the Al bond pad surface, the Al oxide layer on the bond pad was reduced with the plasma cleaning. However, there was no further significant improvement observed in terms of either the ball shear modes or shear values after wire-bonding process and after stress. On the other hand, for the Au-coated Pd bond pad surface, poor bondability and serious non-stick-on-pad (NSOP) were observed in the initial stage without the plasma cleaning. Its bondability has been improved significantly after the plasma cleaning. Both the shear modes and shear values after the wire-bonding process showed significant improvements for the samples with the plasma cleaning. This is mainly because there was an interdiffusion between the Pd and Au layers; the Pd diffused from underneath to the top of bond pad surface and formed Pd oxide, which degraded the bondability of the bond pad. The plasma cleaning improved the top layer surface condition of the Au-coated Pd bond pad by removing/reducing the Pd oxide.

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“…Au−Al bonding system has been researched for many years, generally using high temperature storage experiments [2][3][4] to evaluate bonding reliability. And because Au−Al bonding system can produce many intermetallic compounds [5][6][7][8][9] and Kirkendall void [10,11], it results in a decrease in Au−Al bonding intensity and an increase in contact resistance, even in an open circuit, which result in the failure of the device. With the expansion of the range of application of semiconductors, especially in a harsh environment, a higher reliability for bonding is needed.…”

Section: Introductionmentioning

confidence: 99%

Research on Au-Al bonding properties based on a thermal shock environment

Zhou

Qin-yun

Yang

et al. 2007

Front. Mater. Sci. China

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The thermal shock experiment of Au−Al bonding has been carried out. The mechanical characteristics, structure morphology and electrical characteristics degradation mechanism have also been researched. No cracks were observed in the bonding interface, and the bonding joints also showed good mechanical characteristics with pull stress of 3.0 to 12.0 g. Due to high temperature, the Au−Al intermetallic compound Au 5 Al 2 with high resistibility was formed, which ultimately led to electrical failure. For the samples that were fabricated on the basis of the present technique, the bonding reliability has been evaluated. It has been found that the lifespan rule obeys the Weibull distribution, and at a high temperature of 150°C under 95% confidence level, the estimated results are g = 547 h, m = 3.83. In a room temperature environment, the Au−Al bonding samples' lifespan has also been predicted on the basis of the rule of reliability evaluation. The result shows that the lifespan is about 20 years, while the reliability degree is 90%.

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Wire-Bond Void Formation During High Temperature Aging

Cited by 39 publications

References 9 publications

Bromine- and chlorine-induced degradation of gold-aluminum bonds

Bromine- and chlorine-induced degradation of gold-aluminum bonds

Plasma cleaning on bond pad surfaces for gold wire bonding

Research on Au-Al bonding properties based on a thermal shock environment

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