Proceedings of the 4th International Symposium on Electronic Materials and Packaging, 2002.
DOI: 10.1109/emap.2002.1188815
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Wire bondability of Au/Ni bond pads: effects of metallisation schemes and processing conditions

Yao-Chia Chan
1
,
Jang Kyo Kim
2
,
D. Liu3
et al.
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