Wire pull FEA simulation comparison

Sethu, Raj Sekar; Kulkami, Salil Hari; Ha, How Ung; Soon, Kok Heng

doi:10.1109/eurosime.2018.8369899

2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2018

DOI: 10.1109/eurosime.2018.8369899

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Wire pull FEA simulation comparison

Raj Sekar Sethu¹,

Salil Hari Kulkami

How Ung Ha

et al.

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Wire pull FEA simulation comparison

Cited by 1 publication

References 11 publications

Stress Effect of Wafer Fabrication BEOL Structures On Polysilicon: A Piezoeletric Phenomenon

Stress Effect of Wafer Fabrication BEOL Structures On Polysilicon: A Piezoeletric Phenomenon

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