2023 IEEE 25th Electronics Packaging Technology Conference (EPTC) 2023
DOI: 10.1109/eptc59621.2023.10457586
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Wirebond Stability Resolution on Automotive MEMS Device Through Tape Adhesion Thickness and Plasma Characterization

Behra E. Bamba,
Frederick Ray I. Gomez,
Jane Wanzel E. Rillera
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