2014 IEEE 16th Electronics Packaging Technology Conference (EPTC) 2014
DOI: 10.1109/eptc.2014.7028402
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Wirebondability enhancement for very small die in power packages with dynamic simulation

Abstract: As microelectronics is moving towards miniaturization, function integration and cost reduction, the device itself is becoming smaller while keeping same or even more functions. Silicon die with area less than 2x2 mm 2 is common. This poses challenges for very small die handling and assembly. In another respect, high reliability is required for power packages especially for automotive application. During the development of a new power package module (with 2 devices), wire bondability issue is encountered for th… Show more

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