Wood-derived copper–graphite composites produced via additive-assisted electrodeposition

Johnson, Matthew T.; Childers, Amanda; Carlo, Francesco De; Xiao, Xianghui; Faber, K. T.

doi:10.1016/j.compscitech.2013.09.010

Cited by 5 publications

(10 citation statements)

References 23 publications

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“…Subsequently, the reinforcement phases were infiltrated with nickel matrices by room temperature electrodeposition (Fig. 1C), which efficiently avoided obstacles associated with the most commonly applied high-temperature melt infiltration of metal matrices, such as residual stresses stemming from expansion mismatch between reinforcement and matrix ( 34 , 35 ). During deposition, the electrical conductivity of the pyrolytic carbon was exploited to initiate growth of the metal phase directly on the reinforcement surfaces.…”

Section: Resultsmentioning

confidence: 99%

“…Given the limitations of the applied electrodeposition approach, the presence of residual porosity cannot be fully ruled out and the calculated densities represent the highest possible values. The incorporation of electrolyte additives has been reported to increase robustness in infiltrating high–aspect ratio structures ( 35 ) and could be adopted to improve the synthesis of nanoarchitected IPCs. It is also noted that our IPCs have, in contrast to their cellular counterparts, been exposed to FIB milling during fabrication, which can cause damage that may alter the mechanical properties at the specimen surface ( 52 ).…”

Section: Discussionmentioning

confidence: 99%

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Nanoarchitected metal/ceramic interpenetrating phase composites

et al. 2022

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Architected metals and ceramics with nanoscale cellular designs, e.g., nanolattices, are currently subject of extensive investigation. By harnessing extreme material size effects, nanolattices demonstrated classically inaccessible properties at low density, with exceptional potential for superior lightweight materials. This study expands the concept of nanoarchitecture to dense metal/ceramic composites, presenting co-continuous architectures of three-dimensional printed pyrolytic carbon shell reinforcements and electrodeposited nickel matrices. We demonstrate ductile compressive deformability with elongated ultrahigh strength plateaus, resulting in an extremely high combination of compressive strength and strain energy absorption. Simultaneously, property-to-weight ratios outperform those of lightweight nanolattices. Superior to cellular nanoarchitectures, interpenetrating nanocomposites may combine multiple size-dependent characteristics, whether mechanical or functional, which are radically antagonistic in existing materials. This provides a pathway toward previously unobtainable multifunctionality, extending far beyond lightweight structure applications.

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Section: Resultsmentioning

confidence: 99%

Section: Discussionmentioning

confidence: 99%

Nanoarchitected metal/ceramic interpenetrating phase composites

et al. 2022

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“…In previous experimental work on this material, 1.2 × 1.2 × 0.3 cm 3 scaffolds were used for plating, with the axes of the extended parallel pore channels aligned along the thinnest dimension (L = 0.3 cm, R = 0.003 cm, AR = 50). 9,21 The resulting channels in the scaffold from the vascular pore network are assumed to be uniformly smooth and cylindrical for modeling purposes, and natural variations and small radial openings are neglected. Plating is simulated for 66 hours using a constant current of 10 mA, which is equivalent to an activation overpotential of roughly 0.19 V.…”

Section: Resultsmentioning

confidence: 99%

“…X-ray computed tomography has been used to study the initial stages of copper plating in biomorphic graphite, the results of which are shown in Figure 2. 21 The substrate experienced extensive surface plating that effectively blocked the channels' mouths and prevented further interior plating. An example of excessive choke-off is seen in the micrograph in Figure 3, indicative that choke-off is a crucial consideration in composite processing of this nature.…”

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confidence: 99%

Modeling Macro-Sized, High Aspect Ratio Through-Hole Filling by Multi-Component Additive-Assisted Copper Electrodeposition

Childers

Johnson

Ramírez‐Rico

et al. 2013

J. Electrochem. Soc.

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A multi-element, time-dependent model is used to examine additive-assisted copper electroplating in macro-channels. This model is an adaptation of the work of Akolkar and Landau [J. Electrochem. Soc., 156, D351 (2009)], used to describe plating in micro-vias for integrated circuits. Using their method for describing species movement in the channel, the model has been expanded to include transport and adsorption limitations of the inhibitor and accelerator, as well as the copper ions in solution. The model is used to investigate copper plating as an infiltration method across many size scales and aspect ratios. Biomorphic graphite scaffolds produced from wood are used as a representative system and the results of a two-additive bath are used to characterize the behavior of the additives and determine the effectiveness of the plating. The results indicate that at macro-scales, channel dimensions play an increasingly important role in dictating the behavior of additive-assisted plating. Because additive systems are designed to establish differential surface coverage within the channel, the success of which is determined by the additive's rates of diffusion and adsorption, certain size scale/aspect ratio combinations preclude such coverage. A guide for sample geometries that may be successfully infiltrated with a two-additive bath is provided. Electrodeposition is a common method of producing multicomponent material systems.1,2 This technique is useful in overcoming common melt-based composite processing constraints, such as high melting points, fragile scaffolds, non-wetting components, and significant coefficient of thermal expansion (CTE) mismatch. Unlike melt infiltration or reactive wetting, electrodeposition is a low-temperature, non-reactive process. While electroformed copper is employed in the fabrication of items such as musical instruments, reflectors, and heat exchangers, 1 the electronics sector is responsible for the majority of advancements in the field, especially in terms of use as an infiltration method. Electrodeposition is used for interconnect metallization in integrated circuits, where small channels in a silicon wafer, known as vias, are filled with high purity copper. IBM pioneered this technique in 1998 to replace aluminum vapor deposition.3,4 While the microvias used in current integrated circuit technology can reach several hundred microns in dimension, channel size is trending toward nanosized, closely packed channels. [5][6][7] In other functional composites, one might contend with larger length scales and aspect ratios compared to metal interconnects. With this as motivation, we explore the feasibility of using existing electroplating techniques for composite processing of non-interconnect systems through a multi-component, time-dependent model. Specifically, we investigate infiltration of a metal into highly porous ceramic scaffolds with macro-sized channels.As a macro-porous system for study, we examine biomorphic SiCand graphite-Cu composites produced by electrodeposition, which may ...

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“…The surface was abraded with 120-grit sandpaper to provide roughness similar to that of the graphitized surface in the scaffold. Copper was deposited on the 12 x 7 mm 2 face of one of the rods using an electrodeposition process similar to those described in [24] and [25].…”

Section: Methodsmentioning

confidence: 99%

Interfacial frictional stresses and fracture toughness of biomorphic graphite/copper interfaces

2016

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A fiber push-in test was adapted to measure the interfacial frictional stresses present in woodderived biomorphic graphite/copper interpenetrating phase composites. Additionally, a sandwich composite was used to measure the interfacial fracture toughness of the copper/graphite system. Results indicate that due to poor wetting of copper on graphite, the surface roughness and extent of mechanical interlocking between the two phases determine the mechanical characteristics of the interface, and that the values are comparable to other metal-ceramic composite systems with limited bonding. A characterization of the mechanically bonded interfaces is vital to understanding load transfer, thermal cycling effects, contact resistance, and thermal conductivity.

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Wood-derived copper–graphite composites produced via additive-assisted electrodeposition

Cited by 5 publications

References 23 publications

Nanoarchitected metal/ceramic interpenetrating phase composites

Nanoarchitected metal/ceramic interpenetrating phase composites

Modeling Macro-Sized, High Aspect Ratio Through-Hole Filling by Multi-Component Additive-Assisted Copper Electrodeposition

Interfacial frictional stresses and fracture toughness of biomorphic graphite/copper interfaces

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