2020
DOI: 10.1021/acsami.0c12129
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WSe2 Homojunction p–n Diode Formed by Photoinduced Activation of Mid-Gap Defect States in Boron Nitride

Abstract: A single nanoflake lateral p–n diode (in-plane) based on a two-dimensional material can facilitate electronic architecture miniaturization. Here, a novel lateral homojunction p–n diode of a single WSe2 nanoflake is fabricated by photoinduced doping via optical excitation of defect states in an h-BN nanoflake upon illumination. This lateral diode is fabricated using a mechanical exfoliation technique by stacking the WSe2 nanoflake partially on the h-BN and Si substrates. The carrier type in the part of the WSe2… Show more

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Cited by 38 publications
(48 citation statements)
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“…As a result, a clear type conversion of MoTe 2 TFTs without degradation of electrical properties was obtained, and both n‐type and p‐type MoTe 2 TFTs demonstrated a stable QLED‐operation. This successful type conversion result can be effectively utilized to realize the fundamental and important device application based on MoTe 2 such as p–n diode and complementary inverters, [ 28–33 ] without structural change or additional layer. Moreover, fabricated MoTe 2 TFTs exhibited excellent suppression of photocurrents under UV–near‐infrared (NIR) region, showing a unique advantage for the applications such as display backplane transistors as well as light‐to‐frequency conversion circuits, as compared to other TMDCs and conventional Si materials.…”
Section: Introductionmentioning
confidence: 99%
“…As a result, a clear type conversion of MoTe 2 TFTs without degradation of electrical properties was obtained, and both n‐type and p‐type MoTe 2 TFTs demonstrated a stable QLED‐operation. This successful type conversion result can be effectively utilized to realize the fundamental and important device application based on MoTe 2 such as p–n diode and complementary inverters, [ 28–33 ] without structural change or additional layer. Moreover, fabricated MoTe 2 TFTs exhibited excellent suppression of photocurrents under UV–near‐infrared (NIR) region, showing a unique advantage for the applications such as display backplane transistors as well as light‐to‐frequency conversion circuits, as compared to other TMDCs and conventional Si materials.…”
Section: Introductionmentioning
confidence: 99%
“…The output curves under different back-gate voltages confirm effective tuning by back-gating on the background carrier concentration in WS2. The induced carrier concentration ne by the back-gate can be calculated by the relation ne = Cg(VG-Vth)/e, where VG is the bake-gate voltage, Vth is the threshold voltage, e is the electronic charge and Cg is the combined gate capacitance [23]. For the h-BN flakes with a thickness of 32 nm and the SiO2 film of 285 nm, the combined gate capacitance is ~1.09×10 -8 F/cm 2 , and the induced doping carrier concentration can be evaluated to be ~1.64×10 12 cm -2 at 50 V. Also, we have fabricated controlled back-gated devices of monolayer WS2 deposited on SiO2/Si substrate to compare the effects of different interfaces (See Supplementary).…”
mentioning
confidence: 99%
“…The work function of any sample can be calculated by the following relation. [36][37][38] Contact potential difference CPD…”
Section: Resultsmentioning
confidence: 99%