X-ray diffraction measurement of residual stress and crystal orientation in Au/NiCr/Ta films prepared by plating

Tang, Wu; Deng, Longjiang; Xu, Ke; J, Lu

doi:10.1016/j.surfcoat.2006.10.049

Cited by 14 publications

(5 citation statements)

References 16 publications

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“…Highresolution X-ray diffraction enables the characterization of thickness, crystallographic structure and stress in thin epitaxial films [168,32,195].…”

Section: X-ray Diffractionmentioning

confidence: 99%

Surface technology for automotive engineering

et al. 2009

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“…Highresolution X-ray diffraction enables the characterization of thickness, crystallographic structure and stress in thin epitaxial films [168,32,195].…”

Section: X-ray Diffractionmentioning

confidence: 99%

Surface technology for automotive engineering

et al. 2009

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“…Stress values measured by strain gauges for various loads can be obtained from equation (9). Theoretical values can be calculated from equation (2). CrK a radiation was used under a tube voltage of 30 kV and tube current of 6-8 mA, and the a-Fe {211} plane [8,9] was measured.…”

Section: Measurements On Uniform Strength Beam Of Carbon Steelmentioning

confidence: 99%

“…A laboratory X-ray diffraction stress measurement technique was developed 60 years ago. Among a variety of residual stress measurement techniques, laboratory X-ray diffraction is the most reliable, convenient, and mature non-destructive testing (NDT) approach for the residual stress of a polycrystalline surface [1,2], and is well known for its practicality and accuracy. The principle of laboratory X-ray diffraction stress measurement is based on the measurement of the diffraction angle h and the lattice spacing d, whose change corresponds to the stress according to elasticity mechanics [3].…”

Section: Introductionmentioning

confidence: 99%

X-ray diffraction characteristics of five materials for stress measurement

Wang

et al. 2010

The Journal of Strain Analysis for Engineering Design

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This paper presents the laboratory X-ray diffraction characteristics of five materials: carbon steel (Q235), austenitic stainless steel (1Cr18Ni9Ti), martensitic stainless steel (A335P92), Al alloy (LY12), and Ti alloy (TA15) in X-ray diffraction stress measurement. The difficulty in accurately determining actual stress is illustrated by two diffraction peaks with low diffraction intensity that occur in laboratory X-ray diffraction stress measurement. Stress measurements by both laboratory X-ray diffraction and strain gauges methods were conducted by using uniform strength beams of the five materials. A comparison between measured results and analytical/theoretical results was made to examine laboratory X-ray diffraction characteristics of the five materials for stress measurement. The measurements show that austenitic stainless steel, Al alloy, and Ti alloy present two diffraction peaks in X-ray diffraction stress measurement. Although the CrK a diffraction peak of the {220} plane of austenitic stainless steel is apparent, the stress calculated from this peak does not represent the actual stress; however, the CrK b diffraction peak of the {311} plane, in spite of the lower peak-back ratio, can be used to obtain the actual stress. For the Al alloy, only the CrK a peak of the {222} plane can represent the material's stress. Two diffraction peaks of the Ti alloy measured by CoK a radiation can be used to calculate its actual stress. Hence attention should be paid to which X-ray diffraction peaks can be used for actual stress determination.

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“…To better understand the generation of residual stress so as to effectively control the magnitude of residual stress, the techniques to measure residual stress need to be developed for film-matrix structures. At present, the existing measurement techniques mainly include X-ray diffraction [1,2], Raman spectroscopy [3,4] and measuring by the release of residual stress [5][6][7][8][9][10][11][12]. For the former two methods, only the average residual stress within the measured area can be obtained.…”

Section: Introductionmentioning

confidence: 99%

Residual Stress Measurement in Micro-region Using Digital Image Correlation Method

Han²

2015

Optics

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Abstract:The residual stress of the zirconia film on a stainless steel substrate is measured using the digital image correlation (DIC) method. A lattice structure is milled by focused ion beam (FIB) and used as the deformation carrier. An annular groove is etched by FIB in order to release the residual stress. The DIC method is used to calculate the deformation caused by the release of residual stress and the residual stress is derived by mechanics equations. The results demonstrate that this method can be extended for micro-region residual stress measurement of other thin films on substrates.

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X-ray diffraction measurement of residual stress and crystal orientation in Au/NiCr/Ta films prepared by plating

Cited by 14 publications

References 16 publications

Surface technology for automotive engineering

Surface technology for automotive engineering

X-ray diffraction characteristics of five materials for stress measurement

Residual Stress Measurement in Micro-region Using Digital Image Correlation Method

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