slightly larger than the attraction, barely keeping SWCNTs dispersed. Any effects to even weakly shield the electrostatic repulsion resulted in immediate coagulation. A similar situation prevails in anhydrous polar solvents where electrodeposition is always competing against spontaneous coagulation. At higher electric fields, SWCNT aggregates visible to the naked eye were seen to grow in the dispersion solution, indicating that spontaneous coagulation was in progress. The irregularly shaped aggregates did not adhere strongly to the anode surface, as they were easily washed away by rinsing with solvents. Thus, the reduced density at higher potentials is due to coagulation. Also, the same consideration rejects the possibility of post-deposition, i.e., adsorption of bundles without DC field.The electric field in a parallel-plate capacitor depends only on the electric potential and the distance between the electrodes. We have found that the deposition density is independent of the electrode area. Also, Figure 3 suggests that it is proportional to the electric potential, at least for the best working range. These results suggest that the deposition density is proportional to the electric field.Water sensitivity and field dependence indicate that two processes, electrophoresis and adherence of SWCNTs, must be considered separately. When the anode surface was covered with a polymer film or SiO 2 , no electrodeposition occurred. Similarly, we have shown here that no deposition occurs in water or wet DMF. In all cases, SWCNT aggregates were seen to move toward the anode by electrophoresis. This means that the electric field is necessary to move SWCNTs close to the anode surface, but is not sufficient to bind them. In other words, the electric field controls the aggregate concentration at the surface, but is not responsible for adhesion. Although we speculate that van der Waals' interactions are important for strong adhesion, [12] further study is necessary to clarify the binding mechanism. In summary, anhydrous conditions allow highly efficient DC deposition of SWCNTs. The process requires only a static DC electric field and freshly dispersed, straight SWCNTs. The deposited film is very uniform and tightly bound to the anode surface. This simple technique offers an alternative to CVD or printing methods for thin-film technology.