2002
DOI: 10.1002/sia.1447
|View full text |Cite
|
Sign up to set email alerts
|

XPS study of ion‐beam‐assisted formation of Si nanostructures in thin SiO2 layers

Abstract: Thin thermally grown SiO 2 layers have been enriched with Si up to ∼15 at.% by Si ion implantation at room temperature. X-ray photoelectron spectroscopy (XPS) was used to monitor the composition changes caused in the layers by bombardment with 3 keV Ar ions at elevated temperatures. Argon ion irradiation of pure SiO 2 does not lead to the formation of Si nanoprecipitates. That was the case also for room-temperature Ar bombardment of Si-rich layers. Their 'hot' irradiation with Ar ions was found to enhance cons… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1
1
1

Citation Types

0
6
0

Year Published

2008
2008
2024
2024

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 19 publications
(6 citation statements)
references
References 19 publications
0
6
0
Order By: Relevance
“…The silicon atoms agglomerate into nanocrystals leading to the formation of the Y x Si y O z + Si interfacial composite. The agglomeration of silicon atoms in nanocrystals in the oxide host medium is a well-known effect in thin-film formation on Si. As it appears from our data, this reaction dominates at initial film formation stages. In parallel, the top layer of Y 2 O 3 bulk forms by yttrium target reactive sputtering.…”
Section: Resultsmentioning
confidence: 50%
“…The silicon atoms agglomerate into nanocrystals leading to the formation of the Y x Si y O z + Si interfacial composite. The agglomeration of silicon atoms in nanocrystals in the oxide host medium is a well-known effect in thin-film formation on Si. As it appears from our data, this reaction dominates at initial film formation stages. In parallel, the top layer of Y 2 O 3 bulk forms by yttrium target reactive sputtering.…”
Section: Resultsmentioning
confidence: 50%
“…This is probably caused by the refinement of Si in the electrodeposited film and the formation of bonds between Si and the surrounding impurities such as C, N, and O induced by Ar + bombardment. [13][14][15] Actually, the incorporation of Ar into the electrodeposited film is found whenever Ar + etching is engaged, whereas Ar atom is not detected for a crystalline Si plate etched by Ar + under the same conditions. For Si plates fabricated by other processes, including chemical vapor deposition, the effect of Ar bombardment emerges at a much higher accelerating voltage than that in this study.…”
Section: D76mentioning
confidence: 78%
“…7, 10, and 15 nm. 2p Si XPS spectra of the sample with a 7 nm‐thick coating exhibits increased peak intensity at 103 eV, which is indicative of SiO 2 formation 41. On the other hand, the sample with a 2 nm‐thick coating shows a broad peak at 102 eV, which is indicative of formation of SiO x rather than SiO 2 30.…”
Section: Discharge/charge Capacities Coulombic Efficiencies Of Firstmentioning
confidence: 95%