1997
DOI: 10.1557/jmr.1997.0389
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Y1Ba2Cu3O7–x multilayer structures with a thick SiO2 interlayer for multichip modules

Abstract: For high temperature superconducting multichip modules and other related electronic applications, it is necessary to be able to fabricate several Y1Ba2Cu3O7–x (YBCO) layers separated by thick low dielectric constant dielectric layers. In this work, we report the successful fabrication of YBCO/YSZ/SiO2 (1–2 μm)/YSZ/YBCO multilayer structures on single crystal yttria stabilized zirconia (YSZ) substrates. In contrast to previously reported work, the top YBCO layer did not show any cracking. This is due to a techn… Show more

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Cited by 11 publications
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References 26 publications
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