2014 IEEE 57th International Midwest Symposium on Circuits and Systems (MWSCAS) 2014
DOI: 10.1109/mwscas.2014.6908392
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Yield aware inter-logic-layer communication in 3-D ICs: Early design stage recommendations

Waqas Gul
1
,
Syed Rafay Hasan
2
,
Osman Hasan
3
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