YSZ buffer layers on large technical substrates

Abstract

~b s t r a c t -The ion-beam-assisted deposition (IBAD) of yttria-stabilized zirconia (YSZ) films was extended to large technical substrates such as ceramic plates, metallic tapes and metallic tubes to serve as templates for high-current highly textured IBAD Y SZ films. EXPERIMENTALcarrying Y-Ba-Cu-0 films. These YSZ films are deposited with dual-Kaufman-ion-source equipment. The coating of technical substrates large in comparison to the ion sources requires special measures to provide YSZ films of homogeneous texture quality. With respect to the special growth mechanism of YSZ, a homogenization of the in-plane texture can be achieved by simple movement of the substrate. Up to now we have been able to produce YSZ films on ceramic substrates (10 cm x 10 cm) with a homogeneous in-plane texture of 17" FWHM and on a Ni-tape (1 cm x 50 cm) with a FWHM of 21". The main aspects of the growth mechanismthe influence of the nucleation, the improvement of texture with increasing film thickness and homoepitaxial effectsand the surface morphology are investigated in detail with transmission electron microscopy (TEM) and atomic force microscopy (AFM).

All-chemical YBa2Cu3O7coated conductors on IBAD-YSZ stainless steel substrates

“…It is interesting to compare this CeO MOD 2 surface with that of the underlying YSZ layer shown in the AFM image of figure 1(b). The YSZ surface presents ripple morphology typical of the IBAD process [18]. From the line scan in the inset of figure 1(b) we can observe that the amplitude of the corrugations is of the order of 6 nm.…”

High critical current YBCO coated conductors based on IBAD MgO

“…It functions as a nucleation layer for the IBAD MgO and, in conjunction with the ion-assist beam, promotes (0 0 1) texture normal to the substrate surface as well as biaxial texture for the IBAD MgO film, at its initial nucleation phase. Again, such a layer is not required for IBAD YSZ as both its out-of-plane and in-plane textures slowly evolve with increasing film thickness [12], on a variety of crystalline or amorphous platforms.…”