Zirconium tungstate/cyanate ester nanocomposites with tailored thermal expansivity

Badrinarayanan, Prashanth; Kessler, Michael R.

doi:10.1016/j.compscitech.2011.05.004

Cited by 39 publications

(38 citation statements)

References 25 publications

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“…The extent of CTE reduction caused by ZrW 2 O 8 nanoparticles in this research was in the same range as that observed in the literature for micron sized ZrW 2 O 8 particles [17,21,24,25,35]. A composite prepared for this study with 5 volume% APTES modified micron sized ZrW 2 O 8 (1e15 mm long and 1e2 mm wide) and LaRC-CP1 PI exhibited a CTE of 54.3 AE 3.0 ppm C À1 , which was similar to the average CTE for the nanocomposite at the same loading (56.8 AE 2.0 ppm C À1 ).…”

Section: Coefficient Of Thermal Expansion (Cte)supporting

confidence: 83%

Preparation and properties of polyimide nanocomposites with negative thermal expansion nanoparticle filler

Sharma

Lind

Coleman

2012

Materials Chemistry and Physics

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Section: Coefficient Of Thermal Expansion (Cte)supporting

confidence: 83%

Preparation and properties of polyimide nanocomposites with negative thermal expansion nanoparticle filler

Sharma

Lind

Coleman

2012

Materials Chemistry and Physics

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“…for several min at 270°C). A similar attempt was made by preparation of ZrW 2 O 8 /cyanate ester composites, in which loading of up to 10 vol% of whisker-like ZrW 2 O 8 nanoparticles results in a 20 % reduction in CTE for the thermosetting polymer matrix [11]. However, very active catalytic surface of ZrW 2 O 8 whiskers seriously deteriorates the mechanical properties and thermal resistivity of the composites.…”

Section: Characterization Of Zrw 2 O 8 Particlesmentioning

confidence: 99%

Low Thermal Expansion Composites Prepared from Polyimide and ZrW<su>2O8 Particles with Negative Thermal Expansion

Yamashina

Isobe

Ando

2012

J. Photopol. Sci. Technol.

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Inorganic/polymer composite films with adjustable small thermal expansion were prepared by incorporating sub-m sized particles of zirconium tungstate (ZrW 2 O 8 ) into aromatic polyimide (PI). ZrW 2 O 8 particles exhibit negative coefficients of thermal expansion (CTE) between 4.8 to 8.7 ppm/K. The cross-sectional SEM images of ZrW 2 O 8 /PI composite films indicate that filler particles are homogeneously dispersed in PI matrix without aggregation. The CTEs of these films are linearly decreased with increasing the volume fraction of ZrW 2 O 8 . The CTE of a composite film containing 60 vol% of filler is as low as that of metallic copper (17 ppm/K). Assuming that the thermal expansion behavior is three-dimensionally isotropic, PI composite films containing more than 50 vol% of ZrW 2 O 8 could achieve coefficients of volumetric thermal expansion smaller than 50 ppm/K. Keyword: Polyimide / thin film / zirconium tungstate / thermal expansion / Organic-inorganic composite

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“…Similar to epoxy-based materials, CTE of BMI-, PI-, and CE-based materials can also be reduced by adding significant amount of inorganic fillers [95]- [99], with the results summarized in Table III. It was successfully demonstrated in a silica/CE system that CTE can be reduced from approximately 69 to 23 ppm/K by adding 70 wt% silica fillers [95].…”

Section: B Bmi- Pi- and Ce-based Underfills And Molding Compoundsmentioning

confidence: 88%

“…The thermomechanical behavior of a ZrT 2 O 8 /PI system was studied in [98], proving that a CTE of 23 ppm/K can be achieved with only 22 vol% filler loading. A nanocomposite system of nanoscaled ZrW 2 O 8 /CE was studied in [99], in which the authors could only achieve a minimum CTE of 45 ppm/K (below 100°C) at the maximum filler loading of 10 vol%. Again, these studies have suggested that microscaled fillers are better for CTE reduction for underfills and molding compounds.…”

Section: B Bmi- Pi- and Ce-based Underfills And Molding Compoundsmentioning

confidence: 99%

Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging

Yao

Lü

Boroyevich

et al. 2015

IEEE Trans. Compon., Packag. Manufact. Technol.

102

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Semiconductor encapsulation is crucial to electronic packaging because it provides protection against mechanical stress, electrical breakdown, chemical erosions, α radiations, and so on. Conventional encapsulants are only applicable below 150°C. However, with increasing demand for high-density and high-temperature packaging, encapsulants that are functional at or above 250°C are required. In this paper, five types of encapsulants, including conformal coatings, underfills, molding compounds, potting compounds, and glob tops, are surveyed. First, recommended properties and selection criteria of each type of encapsulant are listed. Second, standard test methods for several crucial properties, including glass-transition temperature (T g ), coefficient of thermal expansion (CTE), dielectric strength, and so on are reviewed. Afterward, commercial products with highoperation temperature are surveyed. However, the results of the survey reveal a lack of high-temperature encapsulants. Therefore, this paper reviews recent progress in achieving encapsulants with both high-temperature capability and satisfactory properties. Material compositions other than epoxy, such as polyimide (PI), bismaleimide (BMI), and cyanate ester (CE), are potential encapsulants for high-temperature (250°C) operation, although their CTE needs to be tailored to limit internal stress. Fillers are reported to be efficient in reducing the CTE. In addition, fillers may also have a beneficial impact on the thermal stability of silicone-based encapsulants, whose high-temperature capability is limited by their thermal instability. IndexTerms-Encapsulant, high-temperature, plastic integrated circuit packaging, power electronic packaging, semiconductor device packaging.

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Zirconium tungstate/cyanate ester nanocomposites with tailored thermal expansivity

Cited by 39 publications

References 25 publications

Preparation and properties of polyimide nanocomposites with negative thermal expansion nanoparticle filler

Preparation and properties of polyimide nanocomposites with negative thermal expansion nanoparticle filler

Low Thermal Expansion Composites Prepared from Polyimide and ZrW<su>2O8 Particles with Negative Thermal Expansion

Survey of High-Temperature Polymeric Encapsulants for Power Electronics Packaging

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