ZnO nanowire-decorated Al₂O₃ hybrids for improving the thermal conductivity of polymer composites

Abstract

The needle-like Al2O3–ZnO nanowire hybrid filler endows polymer composites with high thermal conductivity, mechanical and thermal properties.

Enhanced the Thermal Conductivity of Polydimethylsiloxane via a Three-Dimensional Hybrid Boron Nitride@Silver Nanowires Thermal Network Filler

“…The preparation of PDMS composites refers to the previous work of our research group [ 18 ]. The calculated and weighed BN@xAgNWs hybrid filler is added to the PDMS matrix.…”

“…Polydimethylsiloxane (PDMS) is often used as the matrix material of thermal interface materials because of its excellent properties, such as flexibility, low cost, chemical inertness, water resistance, and flame retardant [ 10 , 11 , 12 , 13 , 14 ]. However, the intrinsic thermal conductivity of PDMS (about 0.2 W·m −1 ·K −1 ) is not ideal to meet the needs of the electronic industry [ 15 , 16 , 17 , 18 , 19 ]. Therefore, it is necessary to improve the thermal conductivity of PMDS to expand its potential applications.…”

“…When the loading of AgNWs thermal film is 2.0 mg/mL, the in-plane thermal conductivity of the composite material is significantly increased to 29.2 W/(m·K) [ 25 ]. Unique connected structure fillers were also reported, which were fabricated by many methods, such as grafting and so on [ 18 , 26 ]. Compared with the traditional single fillers or mixed fillers, hybrid thermal conductive composites can often show better thermal conductivity, resulted from that the synergistic effect of hybrid fillers.…”

Silver Nanoparticle-Enhanced Three-Dimensional Boron Nitride/Reduced Graphene Oxide Skeletons for Improving Thermal Conductivity of Polymer Composites

“…Therefore, various thermally conductive fillers are incorporated into polymers to improve their thermal conductivity. In comparison with carbon materials (i.e., graphite, graphene, and carbon nanotube (CNT)) and metallic particles (i.e., aluminum (Al), copper (Cu), and silver (Ag)), ceramic fillers (i.e., boron nitride (BN), silicon carbide (SiC), aluminum nitride (AlN), and alumina (Al 2 O 3 )) are regarded as ideal candidates due to their excellent electrical insulating characteristics. − BN, known as “white graphite”, has intrigued more research interest than other ceramic counterparts, benefitting from its outstanding in-plane thermal conductivity (200 Wm –1 K –1 ), wide band gap (∼5.9 eV), and low dielectric constant (∼3.9). − Disappointedly, BN-based composites realized by traditional compounding procedures commonly manifest unsatisfactory thermal conductivities, which arises from not only the defective thermal paths induced by random filler arrangements but also the intense phonon scattering in multiple interfaces, which leads to high interfacial thermal resistance, including the thermal boundary resistance ( R b ) in BN/matrix interfaces and the thermal contact resistance ( R c ) in BN/BN interfaces. − …”

Multi‐contact hybrid thermal conductive filler Al2O3@AgNPs optimized three‐dimensional thermal network for flexible thermal interface materials

“…These fillers use multiple Preparation methods, such as grafting, adsorption, adhesion, and so on. Compared with traditional single fillers or mixed fillers, the synergistic effect of hybrid fillers can often build a more complete thermal network inside the composite material, so that the composite material exhibits better thermal conductivity, such as BN@CNT, BN@AgNPs, Al 2 O 3 ‐ZnONWs 4,28–31 …”