2022
DOI: 10.1109/led.2022.3216302
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β-Ga₂O₃ Lateral High-Permittivity Dielectric Superjunction Schottky Barrier Diode With 1.34 GW/cm² Power Figure of Merit

Abstract: In this work, we demonstrate lateral β-Ga 2 O 3 Schottky barrier diode (SBD) with a high permittivity (highk) dielectric superjunction (SJ) structure. Trenches are patterned on the doped β-Ga 2 O 3 epilayer from anode to cathode and high permittivity BaTiO 3 dielectric is deposited on the trenches to uniformly distribute the electric field in the epilayer, which circumvents the extreme difficulties in achieving charge balance using conventional p-n superjunction structures in β-Ga 2 O 3 due to the lack of shal… Show more

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Cited by 37 publications
(18 citation statements)
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“…5(a). 7,[9][10][11][12][15][16][17][18][19][20][21]29,31,32,34) The / V R bk 2 on,sp of 480 MW cm −2 is the highest reported for MDS diode on β-Ga 2 O 3 and is in-class with several other recent β-Ga 2 O 3 diode reports. However, this is accomplished with a very low V .…”
Section: Onspmentioning
confidence: 50%
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“…5(a). 7,[9][10][11][12][15][16][17][18][19][20][21]29,31,32,34) The / V R bk 2 on,sp of 480 MW cm −2 is the highest reported for MDS diode on β-Ga 2 O 3 and is in-class with several other recent β-Ga 2 O 3 diode reports. However, this is accomplished with a very low V .…”
Section: Onspmentioning
confidence: 50%
“…This field management benefit is expected with the high κ due to the induced polarization charge at the dielectric-semiconductor interface. 29,30) However, the MDS F br is substantially lower than the theoretical 8 MV cm −1 for β-Ga 2 O 3 , indicating the presence of strong field crowding at the anode edges. In addition, the TiO 2 interlayer results in a reduction of reverse bias current by several orders of magnitude for the MDS diode versus the SBD.…”
Section: Onspmentioning
confidence: 88%
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“…The availability of highquality melt grown bulk substrates also results in superior epitaxial layer growth 2 and potentially reduced cost. The rapid advances in materials development also enabled many state of the art device realization in both vertical and lateral geometry [3][4][5][6][7][8][9][10][11][12][13][14][15][16] . Vertical devices are of particular interest for high voltage applications due to their superior scalability to high currents compared to lateral devices.…”
mentioning
confidence: 99%
“…Standard solvent clean (Acetone/Methanol/DI water) was performed before device fabrication. After solvent cleaning 300 nm thick BaTiO 3 was deposited using RF sputtering at room temperature in oxygen ambient with O 2 /Ar ratio of 1:10 and at a sputter power of 140W and chamber pressure of 5mTorr 12,23 . Af- ter the dielectric deposition, the samples were annealed at 700 0 C in oxygen ambient for 30 minutes to enhance the dielectric constant.…”
mentioning
confidence: 99%