2019
DOI: 10.21883/jtf.2019.06.47639.298-18
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Субструктура интерметаллического соединения Cu-=SUB=-3-=/SUB=-Sn в тонкопленочном состоянии

Abstract: The crystalline structure of intermetallic Cu_3Sn synthesized by successively condensing thin layers of copper and tin on a substrate at 150°C has been studied. Cu_3Sn compound exists in a very narrow homogeneity range and has a long-period close-packed ordered D0_19 superstructure. It has been found that the crystal lattice exhibits many slip traces associated with dislocation motion. The dislocation motion is due to the stressed state of the crystal, which can be characterized as uniform extension. Electron … Show more

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