This paper describes a decision support system for paper production scheduling. This is the first system to provide an integrated solution to paper production scheduling and to consider interactions between different stages of the manufacturing and distribution process. Using a multicriteria optimization approach, the system generates multiple enterprisewide schedules to reveal tradeoffs between the multiple, often competing, objectives. The large portfolio of algorithms used by the system is embedded in an agent-based decision support framework, called Asynchronous Team (A-Team). Successful implementations of the system in several paper mills in North America have resulted in significant savings and improved customer satisfaction.

A formal approach for integrating Computer-Aided Design (CAD), Computer-Aided Process Planning (CAPP), and shop floor control for rotational components is presented in this paper. It is assumed that this approach will be implemented within the framework of a three level hierarchical CIM architecture that consists of the following levels in the hierarchy: shop floor, workstation and equipment (Joshi et al., 1991). Our approach to CAPP consists of machining feature identification, definition, classification, representation, and reasoning, provided through a CAD model of a product. Geometric entities are identified from a Drawing Exchange Format (DXF) file. The identified entities form the basis for the construction of primitive manufacturing features. The primitive features are assembled together based upon the precedence among features, into a graph, called a feature graph. However, the primitive features may or may not be manufacturable in terms of depth of cut, tool geometry, surface finish, and material handling required. Hence it is necessary to convert the feature graph into a manufacturing task graph, which consists of specifications of alternative functional tasks that are manufacturable. The task graph may be converted into a hierarchical set of process plans, based on the planning criteria at each level in the control hierachy, to reflect the processing requirements at each level. The shop planning function decomposes the task graph into a set of workstation level plans. Each workstation level plan is aggregated into a set of equipment level process plans by the workstation planning function. The equipment level plan is converted into a unique task sequence by the equipment planning function. This sequence is then executed according to specifications by the equipment level execution function. Provision of alternative routes in process plans provides for flexible means of on-line planning and control.

The interrelationships that exist in the manufacturing processes associated with the surface mount manufacture of printed circuit boards (PCBs)

No abstract

The last decade witnessed the increasing use of Surface Mount Technology (SMT) in the assembly of Printed Circuit Boards (PCBs). This fact coupled with increasing component densities, decreasing component pitch, and the need for reliable PCBs has focused attention on the critical components of the manufacturing process including the adhesive used. Components used in PCBs manufactured using SMT, which are to be wave soldered, must be adhesively attached to the board so that they remain in place during the wave soldering process. Utilisation of non‐conducting adhesives for the attachment of electronic components prior to wave soldering has become common throughout the electronics manufacturing industry. The knowledge based adhesive selection adviser described in this paper assists the user (process engineer) in the selection of adhesives for wave soldering of surface mount components. In addition to guiding the user through the adhesive selection process, it provides dispenser related information. This ‘advice’ is derived from the restrictions imposed by the user (including the user's facility temperature), material property requirements, productivity measures and the adhesive dispensing method. The adhesive selection adviser helps the user understand the relationships that need to be considered during adhesive selection. It is applicable to any existing SMT line that uses adhesives within the commercial PCB manufacturing domain.