The fabrication of low-resistance and thermal stable ohmic contacts is important for realization of reliable SiC devices. For then-type SiC, Ni-based metallization is most commonly used for Schottky and ohmic contacts. Many experimental studies have been performed in order to understand the mechanism of ohmic contact formation and different models were proposed to explain the Schottky to ohmic transition for Ni/SiC contacts. In the present review, we summarize the last key results on the matter and post open questions concerning the unclear issues of ohmic contacts ton-type SiC. Analysis of the literature data and our own experimental observations have led to the conclusion that the annealing at high temperature leads to the preferential orientation of silicide at the heterointerface (0001)SiC//(013)δ-Ni2Si. Moreover, we may conclude that onlyδ-Ni2Si grains play a key role in determining electrical transport properties at the contact/SiC interface. Finally, we show that the diffusion barriers with free diffusion path microstructure can improve thermal stability of metal-SiC ohmic contacts for high-temperature electronics.

Three samples of 4H polytype of silicon carbide (4H-SiC) covered with the following sequence of layers: carbon/nickel/silicon/nickel/silicon were investigated with micro-Raman spectroscopy. Different thermal treatments of each sample result in differences of carbon layer structure and migration of carbon atoms thorough silicide layer. Two ranges of Raman shift were investigated. The first one is placed between 1000 cm−1 and 2000 cm−1. The main carbon bands D and G are observed in this range. Analysis of the positions of these bands and their intensity ratio enables one to determine the graphitization degree of carbon layer. Additional information about the changes of the carbon layer structure was derived from analysis of 2D band placed around 2700 cm−1. Application of deep ultraviolet excitation delivered information about the structure of carbon layer formed on the free surface of silicides and the distribution of the carbon inside the silicide layer.