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Проведено исследование различных алгоритмов обработки изображений применительно к задаче рентгеновского контроля печатных плат. Макетирование алгоритмов учитывает стандартные задачи инспекции: поиск зон контакта шарика BGA, поиск зон контакта SMD-компонент, сегментация распайки кристалла, поиск пустот. Осуществлен замер скорости работы алгоритмов в библиотеках OpenCV на «Эльбрус-8С».

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An X-ray inspection is one of the basic methods of non-destructive testing along with optical inspection. Lack of Russian manufacturers in this sector of measuring equipment was a barrier for implementation of the State program «Development of the electronics and radio electronics industry, 2013–2025». High sensitivity X-ray flat panel detector and inspection system concept for non-destructive testing of electronic components were developed. The detector is based on CMOS sensor with pixel pitch 50 um. Key features of the flat panel detector are: limiting spatial resolution 10 LP/mm, reading speed 30 fps, anode voltage range from 20 to 300 kV. Availability of technologies for the production of microfocus sources and flat panel detectors allows creating X-ray inspection system for electronic components for the needs of the microelectronics industry.