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Transmission electron microscopy (TEM) investigations of metal organic vapor phase deposition grown AlxGa1−xN/GaN heterostructures on Si(111) containing an AlN high-temperature buffer layer have been carried out. The structural properties at the interface and in the epilayer as well as the electronic properties suitable for a high electron mobility transistor (HEMT) were analyzed and compared with systems grown on Al2O3(0001). High resolution TEM (HRTEM) at the AlN/Si(111) interface reveals a 1.5–2.7 nm thick amorphous SiNx layer due to the high growth temperature of TAlN=1040 °C. Therefore, a grain-like GaN/AlN region extending 40–60 nm appears and it is subsequently overgrown with (0001) orientated GaN material because of geometrical selection. The residual strain at the AlN/Si(111) interface is estimated to be εr=0.3±0.6% by Fourier filtering of HRTEM images and a moiré fringe analysis. This indicates almost complete relaxation of the large mismatch f(AlN/Si)=+23.4% which seems to be supported by the SiNx layer. Weak beam imaging and plan view TEM show typical threading dislocations in the epilayer with a density of 3×109 cm−2 extending along 〈0001〉 which sometimes form grain boundaries. An AlxGa1−xN/GaN interface roughness of 3 monolayers is estimated and a small AlxGa1−xN surface roughness of 1.5 nm is obtained by HRTEM and atomic force microscopy investigations which correspond to two-dimensional growth. C–V and Hall measurements reveal two-dimensional electron gas at the Al32Ga68N/GaN interface that has a sheet carrier concentration of 4×1012 cm−2. The electron mobility of 820 cm2/Vs measured at room temperature is applicable for a HEMT grown on Si(111).

Room-temperature Hall mobilities exceeding 900 cm2/V s are obtained for AlGaN/GaN heterostructures on (111) Si by single-temperature flow modulation organometallic vapor phase epitaxy. Thin pseudomorphic AlGaN top layers exhibit a 1.5 nm surface roughness and induces a two-dimensional electron gas sheet carrier concentration of 1.0×1013 cm−2. The GaN buffer layer has a background carrier concentration of 1.0×1015 cm−3, 130 arcsec x-ray diffraction full width at half maximum, and a low-temperature photoluminescence linewidth of 10 meV. An AlN nucleation layer provides static electrical isolation between the AlGaN/GaN and the conducting Si substrate. Large crack-free areas of high-crystalline-quality epitaxial material are obtained and have been successfully used for transistor fabrication.

The conditions required to achieve bistability in two-mode semiconductor lasers via the nonlinearity associated with gain saturation are discussed. The laser can be switched between the bistable states through coherent or incoherent optical control. Wavelength bistability in such a laser is demonstrated experimentally.

A single temperature process using AlGaN nucleation layers has been developed that produces device-quality, GaN-based materials with bilayer step surfaces. The AlGaN nucleation layer is deposited by flow modulation organometallic vapor phase epitaxy at temperatures in excess of 1000 °C, where GaN and AlGaN films can be subsequently grown. We have optimized this process on both sapphire and SiC substrates, where the conditions for nucleation are found to be quite different. For growth on SiC, aluminum mole fractions ranging from 6% to 35% result in featureless surfaces. Optimizing the alloy composition and thickness of the nucleation layer on SiC allows the deposition of GaN buffer layers exceeding 5 μm without the formation of cracks. A minimum of 15% aluminum in the nucleation layer is required for smooth growth on sapphire substrates. High room temperature two-dimensional electron gas mobilities of 1575 and 1505 cm2/Vs with sheet charge densities of 1.0×1013 and 1.4×1013 cm−2 are observed in undoped AlGaN/GaN structures placed on insulating AlGaN nucleation layers on sapphire and SiC, respectively.