A.Y.S. Sun scite author profile

The current paper deals with firstly the optimized SMT to assemble various types of QFN (Quad Flat Nonleaded) packages. The important SMT factors such as solder pad and stencil designs will be discussed. Secondly and more importantly, this paper will detail the comprehensive experiment and simulation work done for QFN solder joint reliability modeling. A curve fitted fatigue correlation model together with the use of Schubert's hyperbolic sine lead-free solder constitutive model will be proposed for accurate QFN solder joint reliability prediction.

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A.Y.S. Sun

Modeling Constitutive Model Effect on Reliability of Lead-Free Solder Joints

Drop reliability study of PBGA assemblies with SAC305, SAC105 and SAC105-Ni solder ball on Cu-OSP and ENIG surface finish

Cure shrinkage characterization and its implementation into correlation of warpage between simulation and measurement

Ultra-thin Die Characterization for Stack-die Packaging

Study on the Board-level SMT Assembly and Solder Joint Reliability of Different QFN Packages

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