Study on the Board-level SMT Assembly and Solder Joint Reliability of Different QFN Packages

Sun, Wenjie; Zhu, Wenhui; Danny, R.; Che, F.X.; Wang, C.K.; Sun, A.Y.S.; Tan, Henry

doi:10.1109/esime.2007.360010

Cited by 21 publications

(13 citation statements)

References 3 publications

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“…From the accumulated strain energy density per cycle obtained, the characteristic life was calculated using the fatigue life prediction equation established for QFN solder joint [12]. Since the solder joint reliability requirement (2,000 cycles) was the number of cycles to first failure and not the characteristic life of the solder joint, the characteristic life was instead normalized against the baseline model result that showed no failure at 2,000 cycles.…”

Section: Resultsmentioning

confidence: 99%

“…The fatigue correlation above, which is also known as Schubert's correlation model, has been found to have good prediction accuracy for BGA (ball grid array) laminate-based packages but not for leadframe-based packages like QFN (quad flat no lead). Another study [12] showed that a different fatigue correlation model would work well with solder fatigue life prediction for QFNs:…”

Section: Solder Constitutive and Fatigue Lifementioning

confidence: 99%

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Modeling Study on the Solder Joint Reliability of a Leadframe Package under Powered Thermal Cycling

Talledo¹

2021

JERR

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This paper aims to present a thermo-mechanical modeling approach to predict the solder joint reliability of a leadframe-based package under powered thermal cycling (PTC) test from -40oC to 105oC. The study involves modeling the PTC condition as a standard thermal cycling with a modified temperature boundary to account for the temperature increase due to the applied power to the device package mounted on board. The temperature ramp and dwell times were maintained. Based on the finite element analysis (FEA) results and comparison with actual data, modeling a PTC as a modified thermal cycling process provides a good prediction of the solder joint life. The analysis is simpler and would be beneficial for getting quick assessments of new leadframe package designs.

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Section: Resultsmentioning

confidence: 99%

Section: Solder Constitutive and Fatigue Lifementioning

confidence: 99%

Modeling Study on the Solder Joint Reliability of a Leadframe Package under Powered Thermal Cycling

Talledo¹

2021

JERR

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“…This corner joint was selected for the solder life cycle prediction. The volume-averaging technique presented earlier was implemented to get the accumulated creep strain energy density per cycle for the top solder material interface rom the accumulated strain energy density per cycle obtained, the characteristic life was calculated using the fatigue life prediction equation established for QFN solder joint [3]. But since the requirement (2,000 cycles) was the number of cycles to first failure and not characteristic life of the solder joint, the characteristic life was instead normalized against the baseline model result that showed no failure at 2,000 cycles.…”

Section: Resultsmentioning

confidence: 99%

“…The fatigue correlation above, which is also known as Schubert's correlation model, has been found to have good prediction accuracy for BGA (ball grid array) laminate-based packages but not for leadframe-based packages like QFN (quad flat no lead). Another study [3] showed that a different fatigue correlation model would work well with solder fatigue life prediction for QFNs:…”

Section: Solder Constitutive and Fatigue Lifementioning

confidence: 99%

Improving the Solder Joint Reliability of a Power Leadframe Package Using Thermomechanical Simulation

Talledo¹

2019

JERR

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Leadframe-based packages are commonly used for semiconductor power devices. With these packages, heat dissipation is much better compared with laminate substrated-based packages. However, the solder joint reliability requirement under thermal cycling condition is also higher and this is what makes the development of a power package challenging. One of the usual requirements from customers is that there should be no solder joint failure up to 2,000 thermal cycles. This paper presents the thermomechanical simulation of a power leadframe package that was conducted to improve its solder joint reliability. Board level solder joint cycle life was predicted using finite element analysis and the result was validated with actual solder life result from board level reliability evaluation. Since available solder prediction equation was for the characteristic life (63.2% accumulative failure), using the normalized characteristic life was implemented for predicting the number of cycles to first failure of the solder joint connection and the approach showed good agreement with the actual result. Results also indicated that the choice of epoxy mold material and the type of PCB (printed circuit board) have a significant contribution to the solder joint reliability performance.

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“…for semiconductors [7] and printed circuit board (PCB) manufacturing and assembly [8,9]. These models are usually limited in scope, developed at specific process steps (e.g.…”

Section: Literature Reviewmentioning

confidence: 99%

Combining business process and failure modelling to increase yield in electronics manufacturing

Segura-Velandia

Conway

Monfared

et al. 2010

Proceedings of the Institution of Mechanical Engineers, Part B:

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The prediction and capturing of defects in low-volume assembly of electronics is a technical challenge that is a prerequisite for design for manufacturing (DfM) and business process improvement (BPI) to increase first-time yields and reduce production costs. Failures at the component-level (component defects) and system-level (such as defects in design and manufacturing) have not been incorporated in combined prediction models. BPI efforts should have predictive capability while supporting flexible production and changes in business models. This research was aimed at the integration of enterprise modelling (EM) and failure models (FM) to support business decision making by predicting system-level defects. An enhanced business modelling approach which provides a set of accessible failure models at a given business process level is presented in this article. This model-driven approach allows the evaluation of product and process performance and hence feedback to design and manufacturing activities hence improving first-time yield and product quality. A case in low-volume, high-complexity electronics assembly industry shows how the approach leverages standard modelling techniques and facilitates the understanding of the causes of poor manufacturing performance using a set of surface mount technology (SMT) process failure models. A prototype application tool was developed and tested in a collaborator site to evaluate the integration of business process models with the execution entities, such as software tools, business database, and simulation engines. The proposed concept was tested for the defect data collection and prediction in the described case study.

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Study on the Board-level SMT Assembly and Solder Joint Reliability of Different QFN Packages

Cited by 21 publications

References 3 publications

Modeling Study on the Solder Joint Reliability of a Leadframe Package under Powered Thermal Cycling

Modeling Study on the Solder Joint Reliability of a Leadframe Package under Powered Thermal Cycling

Improving the Solder Joint Reliability of a Power Leadframe Package Using Thermomechanical Simulation

Combining business process and failure modelling to increase yield in electronics manufacturing

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