: Physical vapor deposition (PVD) is one of the thin film fabrication processes in the semiconductor industry. The review paper discusses the different types of PVD methods such as sputtering, cathodic arc deposition, pulsed laser deposition, and ion plating that could be employed in order to fabricate nanoscaled thin film. This paper focuses on the review of Zr-based nanoscaled thin film properties, including the transformation of Zr to ZrO2 based nanofilm as high-k gate dielectric as well as its corrosion, mechanical and degradation resistance is thoroughly analysed. The properties are affected by gas flow rate changes, temperature and crystallinity are discussed in each section. Thus, this review paper informs the researchers on the progress of the thin film to date. Understanding the influence of PVD process parameters in fabricating Zr-based nanoscaled thin film is vital for the long-term continuous improvement.