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Here, we introduce a new bonding technique that enables the joining of different materials at low temperatures and provides a bond superior to that of polymer adhesives at high temperatures, in temperature ranges between 250°C and 500°C. This technique involves a low temperature sintering process that is termed the “Cold Sintering Process,” where a dielectric composite powder material is sintered to function as the adhesive between two other materials being bonded. In order to characterize and further discuss the potential of this new bonding methodology, which we call Cold Sintering Ceramic Bonding (CSCB), we demonstrate the initial mechanical characteristics of samples with sandwich structures of mesh/CSCB/mesh, including four‐point bending, micro‐indentation, and adhesion pull tests. Where appropriate, we compare mechanical properties against low and high temperature epoxies and demonstrate that the CSCB matches up competitively with the epoxies at low temperatures and remains strong at temperatures well above those where standard polymer adhesives fail. Transmission electron microscopy show a high quality interface between a stainless steel plate and the ceramic after the CSCB.