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The application of Fiber Reinforced Thermoplastics (FRTP), which have the advantage of high specific strength and high specific stiffness, is expected to reduce the weight of automobiles. As thermoplastic resin has difficulty in impregnation into fabrics of continuous fibers due to its high viscosity, FRTP products with complicated shapes are usually manufactured by secondary processing of FRTP laminates. As this method uses high-cost FRTP laminates, in which thermoplastic resin is pre-impregnated into fabrics of reinforcing fibers, it is necessary to develop a low-cost FRTP manufacturing process. In previous study, the molding method, by which FRTP can be molded by compression after injection of melted thermoplastic resin into fabrics, was developed. However, due to the high viscosity of thermoplastic resin, this method is limited to fabrics of discontinuous fibers. As the mechanical properties of FRTP depend on the length of the reinforcing fiber, it is necessary to use continuous fiber for superior materials. In this study, Melted Thermoplastic-Resin Transfer Molding (MT-RTM) process, by which FRTP using continuous fiber can be molded at affordable cost, was developed. The effects of molding condition in MT-RTM on the impregnation properties of injected thermoplastic resin into fabrics of continuous fibers were clarified and tensile tests of MT-RTM products were conducted. In MT-RTM, FRTP of complicated shapes with ribs and bosses can be molded integrally by press while keeping the low viscosity of injected resin at mold temperature near the melting point. GFRTP molded by MT-RTM showed good impregnation property and tensile strength equal to that of GF/PA6 laminates molded by press molding.

The aim of this study is to investigate the joint properties of Sn-58mass%Bi and Sn-57mass%Bi-0.5mass%Sb low-melting lead-free solder balls on the electroless Ni/Au and Ni/Pd/Au plated Cu electrodes fabricated with a lead-free plating solution. Compared with the conventional Ni plating solution containing lead, the soldered joints with Ni/Au and Ni/Pd/Au electrodes fabricated with the lead-free plating solution showed comparable joint properties. In the joints with Ni/Pd/Au electrodes, ball shear force increased when the Pd layer is dissolved into solder by multi reflows. In both joints with Ni/Au and Ni/Pd/Au electrodes, a part of the Ni layer was dissolved into solder and thus the (Ni,Cu)3Sn4 intermetallic compound layer formed at the joint interface. Ball shear force decreased upon aging due to the growth of the (Ni,Cu)3Sn4 layer at the joint interface.

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