In situ current density mapping, scanning electron microscopy, and energy dispersive spectroscopy were used to study the effects of cerium as a corrosion inhibitor for an aluminum copper alloy (AI 2024-T4) in chloride containing solutions. It was found that cerium inhibits corrosion of this alloy by reducing the rate of the cathodic reaction. This was due to the formation of cerium-rich films over copper containing intermetallics which act as local cathodic sites. Results from tests carried out on an aluminum/copper galvanic couple, which was used to simulate the electrochemical behavior of the copper containing intermetallics, showed that corrosion inhibition was associated with the formation of a Ce-rich film over the copper in agreement with that observed for the alloy.
In situ x-ray specular reflectivity and glancing-incident-angle x-ray diffraction measurements have been performed at the Au(001) surface in a 0.01 M HC10 4 solution under potential control in an electrochemical cell. At -0.4 V versus an Ag/AgCl electrode, the gold surface exhibits a hexagonal reconstructed layer with a mass density 21% greater than the underlying bulk layers. The reconstruction disappears above 0.5 V, and the excess atoms form a new atomic layer with a density corresponding to 22% of a bulk layer. The reconstruction fully recovers below -0.3 V.
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