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Sn whisker growth behavior, over periods of time up to 10,080 h at room temperature, was examined for Sn and Sn-Cu, Sn-Ag, Sn-Bi, and Sn-Pb coatings electroplated on copper in 2 lm and 5 lm thicknesses to understand the effects of the alloying elements on whisker formation. Sn-Ag and Sn-Bi coatings were found to significantly suppress Sn whisker formation compared with the pure Sn coatings, whereas whisker growth was enhanced by Sn-Cu coatings. In addition, annealed Sn and Sn-Pb coatings were found to suppress Sn whisker formation, as is well known. Compared with the 2-lm-thick coatings, the 5-lm-thick coatings had high whisker resistance, except for the Sn-Cu coating. Whisker growth was correlated with coating crystal texture and its stability during storage, crystal grain microstructure, and the formation of intermetallic compounds at Sn grain boundaries and substrate-coating interfaces.

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The formation of Zn whiskers threatens the reliable operation of electronic equipment with an electrical shorting hazard. As with tin whiskers (much more intensively researched than Zn whiskers), the mechanism of formation is still not clear. This work investigated the Zn whisker growth mechanism for an electroplated Zn coating above a carbon steel substrate from a raised floor tile. Iron-zinc (Fe-Zn) intermetallic and Zn oxides were identified by x-ray diffraction analysis (XRD) and electron probe microanalysis (EPMA). Fe-Zn intermetallic compounds formed on the surface of the Zn layer in addition to the interface between the Zn coating and the steel substrate. Zn oxides formed primarily on the surface of the Zn coating. Fe-Zn intermetallic compounds and Zn oxide formation can be the source of a residual stress that promotes Zn diffusion to the surface of electroplated Zn coating, resulting in the formation of Zn whiskers.

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