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Herein, the effect of Ti2SnC MAX phase reinforcement and friction stir back extrusion (FSBE) parameters on the microstructure, mechanical, electrical, and tribological behavior of Cu‐Ti2SnC composite is investigated. The results indicate that, depending on the rotational speed of the extrusion process, an equiaxed grain microstructure with a uniform distribution of reinforcing particles is formed after the extrusion process. Comparing the extruded samples to the unprocessed samples reveals a larger grain size after extrusion. The absence of MAX phase particles causes the formation of finer grain size in the extruded sample. Under the influence of heat and plastic strain, a reactive layer containing a solid solution of Cu(Sn) or Cu3Sn compounds is formed at the interface of the particle and the copper matrix. By performing the extrusion process, the reactive layer at the interface is broken and scattered on the copper matrix. Furthermore, by applying MAX phase reinforcing particles and performing the extrusion process, the copper matrix's hardness, tensile strength, and wear resistance increase by 128, 99, and 84%, respectively. The five vol% Ti2SnC MAX phases in the extruded copper matrix composite wire results in 7.3% reduction in electrical conductivity.

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This study investigates the fabrication of copper matrix composite reinforced with 8 wt-% of the Ti2SnC phase using friction stir-back extrusion. It explores the effect of rotational speed on the microstructure and properties of Cu–Ti2SnC wire composites. The results showed that the grain size of the composite increased from 3.5 ± 0.6 to 5.7 ± 0.5 µm as the rotation speed increased from 400 to 1000 rev min−1. With the addition of the Ti2SnC phase, the yield and ultimate tensile strength increased by 178% and 33%, respectively. In addition, although the electrical conductivity decreased by 25% by adding 8 wt-% of reinforcement, the electric conductivity of composite wire increased by 19% with the increase of the rotation speed from 400 to 1000 rev min−1.

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