Advancements in functionalities and operating frequencies of integrated circuits lead to the necessity to study Electromagnetic Compatibility/Electromagnetic Emissions (EMC/EMEs) from these devices. In this work, a methodology is developed, which combines near field electromagnetic measurements and 3D layout simulation of an Integrated Circuit (IC), to identify the sources of EME from a commercial IC. This methodology can help to narrow down the area of key importance with respect to EME sources, instead of the entire IC, before it is fabricated. Consequently, IC designers can optimize their design to minimize the EME before fabrication, saving cost and time significantly.