This paper discusses the Espressif Systems latest product ESP32 designed for Internet of Things and embedded system related projects. The ESP32 is a low-cost, low-power system on a chip series of microcontrollers with Wi-Fi and Bluetooth capabilities and a highly integrated structure powered by a dual-core Tensilica Xtensa LX6 microprocessor. This paper provides a comparative analysis of the ESP32 with some other market competitors and introduces the microcontroller specification, features and programming details. A portable, wireless oscilloscope based on the ESP-WROOM-32 and a mobile application is described in detail as an example of successful practical implementation of the device.

Integrated Computational Materials Engineering (ICME) is an emerging discipline that aims to integrate computational materials science tools into a holistic system that can accelerate materials development, transform the engineering design optimization process, and unify design and manufacturing. A team of aerospace Original Equipment Manufacturers (OEMs) and suppliers have executed a critical program to address the United States Air Force (USAF) funded Foundational Engineering Problem (FEP) on residual stress within nickel-base superalloy components. This program was aimed at establishing methods to link predictive tools to component design functions and product realization activities with industry-wide standardized protocols. The multi-disciplinary approach links supplier and OEM materials and process models with structural analysis tools to enable manufacturing parameter selection based on disk design criteria. By linking analytical tools between the supplier and OEM, process parameters may be optimized for reduced scrap, while optimizing disk designs for design requirements. A significant challenge to doing this is qualifying and integrating sources of variation in the materials and process models with design and structural analysis tools. This paper reviews ICME infrastructure tools and methods that were used to demonstrate and validate linked residual stress-based materials and manufacturing model capabilities with design activities to achieve an optimized final component. This work was funded by the United States Air Force through the Metals Affordability Initiative (MAI).

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This paper discusses the development of an algorithm for the data analysis to monitor Two-Wire-Interface operation in order to improve the reliability of communication. This algorithm is designed to improve code-efficiency with regards to hardware modelling. An algorithm for the protocol used in the Standard-Mode, Fast-Mode, Fast-Mode Plus and High-Speed-Mode was developed. The proposed algorithm has been derived using the bus protocol specification and implemented in hardware via a hardware description language. The correct operation of the algorithm was proofed by applying the hardware system on a sample communication. The paper also describes the development process of embedded systems and provides information on aspects regarding hardware modelling including a mathematical description of the TWI protocol is provided.