We report the study of optically induced terahertz (THz) electromagnetic radiation from (110) oriented zinc-blende crystals. This work extends our previous studies of (100) and (111) GaAs. Excellent agreement between calculated results and experimental data indicates that, under conditions of moderate optical fluence and normal incidence on the unbiased sample, second-order optical rectification is the major nonlinear process that generates THz radiation.
Radical reduction of III–V device costs requires a multifaceted approach attacking both growth and substrate costs. Implementing device removal and substrate reuse provides an opportunity for substrate cost reduction. Controlled spalling allows removal of thin devices from the expensive substrate; however, the fracture‐based process currently generates surfaces with significant morphological changes compared to polished wafers. 49 single junction devices are fabricated across the spalled surface of full 50 mm germanium wafers without chemo‐mechanical polishing before epitaxial growth. Device defects are identified and related to morphological spalling defects—arrest lines, gull wings, and river lines—and their impact on cell performance using physical and functional characterization techniques. River line defects have the most consistent and detrimental effect on cell performance. Devices achieve a single junction efficiency above 23% and open‐circuit voltage of 1.01 V, demonstrating that spalled germanium does not need to be returned to a pristine, polished state to achieve high‐quality device performance.
We present recent experimental results of difference-frequency generation (DFG) and sum-frequency generation (SFG) from zincblende materials. We measure the radiation field of difference-frequency generation and the radiation intensity of sum-frequency generation versus crystallographic orientation and fundamental photon energy. The simultaneous measurement of the angular dependence of polarized DFG and SFG is well characterized by the bulk second-order nonlinearity calculation. Pronounced resonant behaviors near the GaAs band gap for both radiations (DFG and SFG) are compared.
Molecular beam epitaxy offers an exciting avenue for investigating the behavior of topological semimetal Cd3As2, by providing routes for doping, alloying, strain engineering, and heterostructure formation. To date, however, minimal exploration has been devoted to the impact of defects that are incorporated into epilayers due to contraints imposed by the substrate and narrow growth window. Here, we use a combination of lattice-matched ZnxCd1-xTe buffer layers, miscut substrates and broadband illumination to study how dislocations, twins and point defects influence the electron mobility of Cd3As2. A combination of defect suppression approaches produces Cd3As2 epilayers with electron mobilities upwards of 15,000 cm 2 /V-s at room temperature.
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Exploiting the extraordinary transport and optical properties of 3D topological semimetals for device applications requires epitaxial integration with semiconductors to carefully control carrier transport, yet no studies have established heteroepitaxy on top of any topological semimetals to date. Here, a novel approach toward fabricating heterostructures is demonstrated by epitaxially incorporating the Dirac semimetal Cd 3 As 2 between Zn x Cd 1-x Te and CdTe layers via molecular beam epitaxy on GaAs (001) substrates. The approach utilizes the higher energy (001) surface of Cd 3 As 2 to stabilize 2D epitaxy of zinc blende semiconductors. To demonstrate the impact heterostructure formation offers to device performance, an all-epitaxial, barrier-type vertical photodetector is fabricated that accesses a different carrier separation mechanism than previously reported non-epitaxial junctions and consequently exhibits significantly reduced dark currents. The results highlight the important role that epitaxial integration can play in accessing advanced architectures for topological semimetal-based devices.
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