No abstract

Quinoline is a preferred scaffold that emerges as a prominent assembly motif for the creation of novel pharmacological molecules among heterocyclic compounds. An important family of chemicals includes quinoline and its derivatives that have been studied for various biological activities. Due to its wide range of bioactivity, quinoline, which is made up of benzene fused with N-heterocyclic pyridine, has drawn a lot of interest as a key template in drug creation. In order to demonstrate the quinoline motifs' significant efficacies for upcoming drug development, this review intends to provide the most current developments in chemistry, their medicinal potential, and their pharmacological applications. As a result, these compounds have been produced by several scientific groups as intentional structures, and their biological functions have been examined. The current study offers succinct information on quinoline's natural sources, as well as details on newly marketed medications that include quinoline. The pharmacological effects of quinoline derivatives, such as their anticonvulsant, antibacterial, antiviral, anti-protozoal, antimalarial, anticancer, anti-inflammatory, and anthelmintic properties, are also discussed in this study. Keywords: Nitrogen-Based Heterocycles, Quinoline, Synthesis, Biological Activities

Influence of alumina nanoparticles in the epoxy adhesive on the load-carrying capacity of single lap joints was investigated using the finite element method. Nanocomposite adhesives were modelled by reinforcing randomly distributed spherical shaped (at 0.5, 1.0 and 1.5 wt.%) and rod-shaped (at 0.5 and 1.0 wt.%) alumina nanoparticles in the epoxy. 2D finite element was used to discretise the domain of single lap joint comprising nanocomposite adhesives. The load-carrying capacity of single lap joints bonded with nanocomposite adhesive comprising 1.5 wt.% of nanospheres and 1.0 wt.% of nanorods was 58% and 51% more than that of joints with neat adhesive, respectively. The distribution of von-Mises stress, shear stress and peel stress at adherend/adhesive layer interface along the overlap length of the joint was analysed.