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Poly‐(2,6‐dimethyl)‐1,4‐phenylene oxides and related copolymers have been evaluated for high temperature adhesive applications. Because of the high‐melting character of these polymers, proper wetting was found to be difficult to achieve. Where such conditions can be obtained, good tensile strength values have been reached up to 600°F. The introduction of allyl group and epoxy group into such polymers provides sites for thermosetting. The fast setting rate of these groups, however, introduces difficulty in bonding procedure. Problems and ways to improve the initial bonding of specimens are discussed.