Two-dimensional
(2D) bismuth oxychalcogenide (Bi2O2X, X refers
to S, Se, and Te) is one type of rising semiconductor
with excellent electrical transport properties, high photoresponse,
and good air stability. However, the research on 2D Bi2O2S is limited. In this work, ultrathin Bi2O2S nanosheets are synthesized by a facile and eco-friendly
chemical synthesis method at room temperature. The thickness and lateral
sizes are 2–4 nm and 20–40 nm, respectively. The 2D
ultrathin Bi2O2S nanosheets have a broad absorption
spectrum from ultraviolet (UV) to near-infrared (NIR). Photoelectrochemical
(PEC) photodetectors based on 2D Bi2O2S nanosheets
are fabricated by a simple drop-casting method. The 2D Bi2O2S-based PEC photodetectors show excellent photodetection
performance with a broad photoresponse spectrum from 365 to 850 nm,
a high responsivity of 13.0 mA/W, ultrafast response times of 10/45
ms, and good long-term stability at a bias voltage of 0.6 V, which
are superior to most 2D material-based PEC photodetectors. Further,
the 2D Bi2O2S PEC photodetector can function
as a high-performance self-powered broadband photodetector. Moreover,
the photoresponse performance can be effectively tuned by the concentration
and the kind of electrolyte. Our results demonstrate that 2D Bi2O2S nanosheets hold great promise for application
in high-performance optoelectronic devices.
A two-layer approach is reported for the formation of a thermally triggered reversible adhesive, involving a thermally-responsive polymer matrix coated on tannic acid-pretreated substrates/tissues. Interfacial adhesion originates from strong molecular interactions of tannic acid with both the polymer matrix and the substrate/tissue. The reversibility is due to a temperaturetriggered phase transition of the polymer matrix, leading to cohesive failure. Depending on different gelation mechanisms, the polymer forms a highly cohesive gel or soft solid upon either warming or cooling, leading to a strong adhesion to the tissues at physiological temperatures. Detachment of the adhesive is triggered by a temperature-induced compromise of cohesive strength of the polymer matrix, by the opposite gel-to-sol transition. This facile, low-cost, and modular design offers a reversible adhesive platform which is useful for biomedical and industrial applications.
A flame‐retarded epoxy resin (ER) adhesive with strong flame retardancy and adhesion performance was prepared. The coated ammonium polyphosphate (MFAPP), melamine (MEL), and organic montmorillonite (OMMT) were mixed to prepare a composite flame retardant. It was subsequently blended with a toughened ER thoroughly and then the mixture was cured with polyamide. The resultant ER adhesive thermosets achieved UL‐94 V‐0 rating during vertical burning test, and the limiting oxygen index value was as high as 31.6%. The shear strength of the ER adhesive was 27.9 MPa when 25 wt% MFAPP/MEL/OMMT was introduced. Compared with the pure adhesive, the flame retardant epoxy adhesive maintained outstanding adhesion performance because of the good compatibility between the composite flame retardant additives and the toughened ER adhesive. Cone calorimetry tests indicated that the release of heat and smoke were obviously declined with the incorporation of the composite flame retardant system in comparison to pure ER adhesive thermoset. The investigation of flame retardant mechanism revealed that the composite MFAPP/MEL/OMMT flame retardant system stimulated the generation of highly expanded, integral, and strong char layer and the formed char layer exerted superior insulation effect during combusiton. The present work provided an alternative approach to prepare flame retardant ER adhesive with the similar excellent adhesive performance.
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