This paper presents an 802.11ad-based radio frequency module for high data rate fixed wireless access and backhaul communications. The transceiver chip is manufactured in SiGe BiCMOS technology covering 57–71 GHz, providing 16 RX and 16 TX paths with combined output power of more than 20 dBm. The chip is packaged using embedded wafer-level BGA technology of the size $$12.6\times 12.6\times 0.8~{\text{ mm }}^3$$ 12.6 × 12.6 × 0.8 mm 3 and employs advanced dielectric materials with 2 metallic redistribution layers. The package integrates the transceiver chip with RX and TX high gain PCB antenna arrays, allowing effective isotropic radiated power (EIRP) of more than 40 dBm. Beam steering is achieved in ± 50$$^{\circ }$$ ∘ by the transceiver through providing appropriate weights to the antenna arrays. The paper presents generation of beamforming lookup table along with optimization of the power distribution to the array. This optimization results in flattening of the EIRP over the whole beam-steering range and frequency bandwidth. The module allows for data rates up to 10 Gbps by employing full-channel 128 QAM and half-channel 256 QAM single-carrier modulation.