This paper presents the results of the first human trials with the ENOBIO electrophysiology electrode prototype plus the initial results of a new wireless prototype with flexible electrodes based on the same platform. The results indicate that a dry active electrode that employs a CNT array as the electrode interface can perform on a par with traditional "wet" electrodes for the recording of EEG, ECG, EOG and EMG. We also demonstrate a new platform combining wireless technology plus flexible electrodes for improved comfort for applications that take advantage of the dry electrode concept.

A method to fabricate thermoplastically deformable electronic circuits is presented, with the intent of achieving low-cost 2.5D free-form rigid smart objects. This by utilizing existing flexible circuit technology based stretchable circuits, in combination with thermoplastic materials. After fabricating the circuit in a flat state, a thermoforming step shapes the device by heating it beyond its glass transition temperature, and pushing it against a mold. Preliminary tests show the feasibility to fabricate simple circuits using off-the-shelf circuit components; showing a minimal decrease in conductivity of the polyimide supported copper-based interconnects.

decade, substantial efforts were devoted to the research and development of the nextgeneration composites. This new class of materials should not only possess higher strength-to-weight ratio than metals but also tailored with integrated intelligence, which is desirable as infrastructures for next generation of "internet of things." Carbon nanomaterials, such as carbon nanotubes and carbon nanofibers, have received dominant attention for the creation of intelligent composites. [3][4][5][6] They were dispersed in a polymer matrix to form conductive percolating networks as distributed sensors in situ to evaluate the strain, stress, damage, and temperature for self-sensing and on-line structural health monitoring applications. [3][4][5][6] However, these composites are restricted to (piezo) resistive effect based sensing capabilities from the included nanomaterials. Nextgeneration composites, however, should not only encompass sensing capabilities but also be equipped with other functionalities such as lighting, computation, and communication elements, as illustrated in Figure 1. One straightforward solution to achieve this goal is to integrate electronic circuits with off-the-shelf components in the composites. However, these functional composites usually have complex, 3D shapes, but conventional electronic circuits are rigid and planar. The shape mismatch between 3D composites and planar, rigid electronic circuits causes difficulties in integrating electronic circuit-based intelligences.Recent advancement of flexible and stretchable circuits has paved the way for integration of electronics in unusual shapes and forms. Through materials and structure innovation, [7] the circuits become stretchable, deformable, and conformable to curvilinear surfaces, [8][9][10] enabling a spectrum of applications such as stretchable sensors and actuators, [11][12][13][14] transparent conductors, [15,16] lighting, [17][18][19] and energy devices. [20][21][22] Various types of stretchable nanomaterials, such as carbon nanomaterials [23][24][25] and metal nanowires [26][27][28] have been synthesized and integrated to elastomeric polymer matrix for stretchable circuits. Despite their superior mechanical properties and potential to achieve transparent stretchable circuits, so far it has been a struggle to deliver high enough conductivities compared to structure engineered stretchable circuits.Fiber-reinforced polymer composites with integrated intelligence, such as sensors, actuators, and communication capabilities, are desirable as infrastructures for the next generation of "internet of things." However, the shape mismatch between the 3D composites and a planar electronic circuit causes difficulties in integrating electronic circuit-based intelligences. Here, an easily scalable approach, by incorporating a large-area stretchable circuit with thermoforming technology, to fabricate 3D multifunctional composites is reported. The stretchable circuit is first fabricated on a rigid and planar carrier board, then transferred and sandwiched bet...

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