along with same bond pad, copper will introduce hardness The characterization of inter-metallic coverage and inter-related issues, because copper is relatively harder than gold metallic phase's (IMPHs) growth in gold ball bonds on material. When we use the same wire bonder and apply aluminum bond pads are quite well understood and there is similar fundamental process parameters, copper will lead to relatively a very less literature available regarding the problems like crater, etc. The fact is copper strain hardens morphology and growth of the IMPHs and remnant aluminum even during bonding and makes it more difficult to bond on mo~~~~~~~~~~~~~nsrfae Evegy n grwe modi the bon pa, problremsan likeum requirement in copper ball bonds on aluminum bond pad any surface Even we modify the bond pad, problems like metallization. Development and optimization of robust copper oxidation observed in the free air ball (FAB) formation occurs.wire bonding processes are very popular now a days and it Steps have been taken to rectify the oxidation problem, by requires an assessment of remnant aluminum, inter-metallic providing a shield gas (forming gas: 95% N2 and 500 H2) coveage*ndoppe-aluinu inigroh aer, bond pad metallization and bonding parameters are optimized coverage and copper-aluminum inter-metallic growth after isothermal aging under the condition of with and without to avoid the pad peeling and oxidation issues. At this point epoxy molding stages. The assessment of the remnant perfect bond ability is achieved by the wire bonders using the Aluminum and inter-metallic compound formation between suitable forming gas kit and parameters. copper-aluminum is very important in microelectronicOn completion, the wire bonded unit will undergo packaging units. Because the reliability (interfacial shear reliability checking. This is crucial for any IC device force, open failure etc.) of copper ball onto the aluminum packages. Reliability is important for the copper wire bonded based bond pad in microelectronics packaging depends on the unit under different (JEDEC levels) reliability test conditions. remnant aluminum and Cu-Al inter-metallic's formation. This To pass the reliability test, a sufficient amount of remnant study reports a minimum requirement of remnant aluminum Aluminum is necessary in the bonded unit. The remant needed in the copper wire bonding on aluminum pad that were aluminum depends on the bonding parameter, EFO parameters subjected to annealing for long intervals of time from 0 to 300 (firing time, current), purity of Cu wire (3N, 4N, 5N) and hrs using different purity wires (3N and sN). This study gives bond pad compositions (Si, Cu etc). In wire bonder, we can information about how much Aluminum pad thickness is vary the bonding and EFO parameters to achieve the needed for any purity of copper wire bonding and how long optimized bond parameter. When we change the wire type, we the interfacial shear force will increase/decrease with the would not know, what will happen in the material between baking time and also ...

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