All activity in modeling transient diffusion behavior relies on knowledge of the inert intrinsic diffusivities of dopants in Si. The measurements upon which these values are based were conducted over 15 years ago. Since then, the quality of wafers used in industrial applications has significantly changed. This will affect the effective diffusivity through changes in trap concentrations. The reliability of measurement techniques has also changed dramatically from tracer and staining methods to secondary ion mass spectrometry ͑SIMS͒ measurements that are dominant today. Finally, our understanding of diffusion behavior has changed significantly. For example, we now understand that the extraction of diffusivities from implanted samples with no pre-anneal includes a significant transient effect. We have measured the inert intrinsic diffusivities of As, B, P, and Sb in different substrates in defect-free Czochralski and float zone wafers and epitaxially grown layers. All samples underwent a 30 min anneal at 1000°C in dry oxygen in order to grow a cap oxide and eliminate transient enhanced diffusion. We performed SIMS analysis on an initial batch of samples to evaluate the different factors that may affect the diffusivity in a nonideal manner and concluded that there are no transient effects but that surface effects are important. Hence, for the fast moving dopants ͑B, P͒ we restrict our data extraction to the deep implants. Our data show that B and P diffusivities are different than the values commonly assumed in the literature at low temperatures. We compare our results to previously published data in light of the factors mentioned here.