Abstract-This paper explores contact heating in microelectromechanical systems (MEMS) switches with contact spot sizes less than 100 nm in diameter. Experiments are conducted to demonstrate that contact heating causes a drop in contact resistance. However, existing theory is shown to over-predict heating for MEMS switch contacts because it does not consider ballistic transport of electrons in the contact. Therefore, we extend the theory and develop a predictive model that shows excellent agreement with the experimental results. It is also observed that mechanical cycling causes an increase in contact resistance. We identify this effect as related to the build-up of an insulating film and demonstrate operational conditions to prevent an increase in contact resistance. The improved understanding of contact behavior gained through our modeling and experiments allows switch performance to be improved.[1424]

By integrating interferometric deflection data from electrostatically actuated microcantilevers with a numerical finite difference model, we have developed a step-by-step procedure to determine values of Young's modulus while simultaneously quantifying nonidealities. The central concept in the methodology is that nonidealities affect the long-range deflections of the beams, which can be determined to near nanometer accuracy. Beam takeoff angle, curvature and support post compliance are systematically determined. Young's modulus is then the only unknown parameter, and is directly found. We find an average value of Young's modulus for polycrystalline silicon of 164.3 GPa and a standard deviation of 3.2 GPa (2%), reflecting data from three different support post designs. Systematic errors were assessed and may alter the average value by 5%. An independent estimate from grain orientation measurements yielded 163.4-164.4 GPa (the Voigt and Reuss bounds), in agreement with the step-by-step procedure. Other features of the test procedure include that it is rapid, nondestructive, verifiable and requires only a small area on the test chip. [619] Index Terms-Free-standing thin films, characterization, mechanical properties, statistical accuracy assessments. I. INTRODUCTION K NOWLEDGE of mechanical properties is critical to the design of MEMS. Nanoindentation [1] is commonly used to determine properties of thin films attached to a substrate, but substrate compliance and tip shape effects introduce considerable complexity into analysis methods (see, for example, [2] and references, therein). Free standing thin-film structures are Manuscript

This paper explores the deflection and buckling of fixed-guided beams used in compliant mechanisms. The paper’s main contributions include the addition of an axial deflection model to existing beam bending models, the exploration of the deflection domain of a fixed-guided beam, and the demonstration that nonlinear finite element models typically incorrectly predict a beam’s buckling mode unless unrealistic constraints are placed on the beam. It uses an analytical model for predicting the reaction forces, moments, and buckling modes of a fixed-guided beam undergoing large deflections. The model for the bending behavior of the beam is found using elliptic integrals. A model for the axial deflection of the buckling beam is also developed. These two models are combined to predict the performance of a beam undergoing large deflections including higher order buckling modes. The force versus displacement predictions of the model are compared to the experimental force versus deflection data of a bistable mechanism and a thermomechanical in-plane microactuator (TIM). The combined models show good agreement with the force versus deflection data for each device.

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