No abstract

Incorporation behaviors of In and Ga of InGaN films grown by the two-heater metal-organic vapor-phase epitaxial horizontal reactor is investigated by varying growth parameters, such as the substrate temperature, ceiling temperature and reactor pressure. Two In loss mechanisms are observed by the analysis of the concentration and temperature profiles in the deposition zone. The gas-phase parasitic-loss mechanism (activation energy ∼ 34.2 ± 0.1 kcal/mol) is significant in the ceiling temperature T ceil ≥ 800 • C and at substrate temperature (T sub ) of 600 • C. The decomposition-loss mechanism, which arises from In desorption on the growing surface, is significant in T sub > 625 • C region. The desorption activation energy obtained is 28.0 ± 0.1 kcal/mol, which is close to that of . This suggests the In decomposition-loss mechanism in InGaN growth does not differ substantially from that in binary InN growth. On the other hand, the gas-phase parasitic-loss mechanism of Ga is negligible in the growth condition that we have explored. Exception is found for reactor pressure at T ceil = 950 • C, where both factors advantageous and disadvantageous to Ga incorporation are unambiguously observed. We have proposed explanation for the above observation. The promising electronic and optical properties of InGaN alloy, such as high two-dimensional electron gas (2DEG) electron mobility, wide tunability of photon emission energy from 0.7 to 3.4 eV, have given rise to numbers of applications in the past decade. These include high power and high electron mobility transistor (HEMT), visible light emitting devices, tandem solar cell, and solid state lighting.1-7 To realize, a method that capable of growing device-quality III-V nitrides is essential. Among all growth methods, metal-organic vapor-phase epitaxy (MOVPE) has proved itself to be the most reliable and major tool to produce these devices with mass-production feasibility. However, difficulties arise for this method in preparing high In content In x Ga 1−x N film (x > 30%) with acceptable optical and electrical properties. This stems mainly from the intrinsic properties of material itself, such as thermal instability of InN, wide miscibility gap, and large thermal-and lattice-mismatch between InGaN layer and underlying GaN base layer, and poor cracking efficiency of NH 3 . These lead to generations of considerable amounts of nitrogen vacancies, pits, In-rich clusters and/or structure defects in the film to deteriorate its material properties. [8][9][10][11][12][13][14][15][16][17] In our previous work, we have employed a so-called the two-heater MOVPE horizontal reactor, consisting of a pair of paralleled ceiling and substrate heaters, 18 to grow InGaN films. We demonstrated its ability in preparing high In-content thick InGaN films with emission wavelength extended into infrared color region, and more importantly exhibiting good optical-quality and high spectral uniformity. For instance, a sample with x = 0.40 In x Ga 1−x N film has a mean emission wavelength of 808 ± 6 nm a...