No abstract

In this paper, the ongoing research and development activities on future nonvolatile memory technologies incorporating new switching materials are described. Memory concepts based on switching effects in inorganic and organic materials as well as in single molecules and carbon nanotubes are reviewed. Examples of the typical aspects that must be covered during the development of a memory incorporating a new switching material are illustrated using the results from the development of a ferroelectric memory.

IrO 2 and Ir thin films have been deposited by dc sputtering in Ar/O 2 -and pure Ar atmospheres, respectively. The microstructural characterization of the films was done by x-ray diffraction and transmission electron microscopy and showed that ͑nano-͒crystalline Ir and IrO 2 films with different textures could be deposited. Stress analyses showed that the stress of the Ir films can be varied from about Ϫ3.5 GPa for a deposition temperature of 100°C to nearly zero stress if deposited at 500°C. However, IrO 2 films generally exhibited a large compressive stress of about Ϫ1.5 GPa, which is nearly independent of substrate temperature, but changed with texture and stoichiometry of the films. Surface and roughness analyses of the cumulatively annealed samples were performed by various analysis methods, and stoichiometry was examined by Rutherford backscattering spectrometry. In situ stress measurements were used to investigate the stress relaxation behavior of the films up to 900°C. We demonstrate that it is generally possible to optimize reactive IrO 2 sputter deposition by a detailed study of plasma and deposition conditions via recording generic curves for the sputtering system used. At optimized conditions these fine grained IrO 2 films exhibit very high thermal phase stability to at least 800°C for several hours and a very low roughness. The aim of these investigations is to optimize stability of IrO 2 films under high temperature conditions for oxygen barrier application in dynamic random access memory and nonvolatile Fe random access memory cells.

The influence of the deposition temperature during the reactive sputtering process on the microstructure of thin Ir and IrO2 films deposited on oxidized Si substrates was investigated and related to the oxygen barrier effectiveness. For this purpose differential thermal analysis combined with residual gas analysis by mass spectrometry was used for the investigation of the microstructural and chemical behavior of the as-sputtered IrO2 films upon heating. Moreover, in situ stress relaxation analyses up to 900 °C, in and ex situ x-ray diffraction measurements were done for various annealing conditions. The investigated polycrystalline IrO2 films exhibited a large compressive stress and a distorted lattice due to the sputter deposition process. It is demonstrated that a high deposition temperature involves a delayed relaxation of the IrO2 grains which is causing an extrinsic, enhanced defect controlled oxygen mobility for the annealing temperatures below the recrystallization. The well-known low intrinsic oxygen diffusivity was only found in those samples which show—in addition to the recovery process—a recrystallization at low temperatures and thus a formation and growth of a new generation of grains with a lattice spacing as in bulk IrO2. Moreover, the oxygen diffusion in Ir films was investigated and the oxygen was found to penetrate the Ir films very quickly at elevated temperatures. The microstructure of the films was investigated by cross sectional transmission electron microscopy and it is shown that the cold-sputtered columnar IrO2 films protect the underlying layers from oxidation during a 700 °C high temperature oxygen anneal with an optimized Ir/IrO2 oxygen barrier stack.

Silver (Ag) layers were deposited by remote plasma enhanced atomic layer deposition (PALD) using Ag(fod)(PEt3) (fod = 2,2-dimethyl-6,6,7,7,8,8,8-heptafluorooctane-3,5-dionato) as precursor and hydrogen plasma on silicon substrate covered with thin films of SiO2, TiN, Ti/TiN, Co, Ni, and W at different deposition temperatures from 70  to 200 °C. The deposited silver films were analyzed by x-ray photoelectron spectroscopy (XPS), atomic force microscopy (AFM), scanning electron microscopy (SEM), transmission electron microscopy (TEM) with energy dispersive x-ray spectroscopy, four point probe measurement, ellipsometric measurement, x-ray fluorescence (XRF), and x-ray diffraction (XRD). XPS revealed pure Ag with carbon and oxygen contamination close to the detection limit after 30 s argon sputtering for depositions made at 120 and 200 °C substrate temperatures. However, an oxygen contamination was detected in the Ag film deposited at 70 °C after 12 s argon sputtering. A resistivity of 5.7 × 10−6 Ω cm was obtained for approximately 97 nm Ag film on SiO2/Si substrate. The thickness was determined from the SEM cross section on the SiO2/Si substrate and also compared with XRF measurements. Polycrystalline cubic Ag reflections were identified from XRD for PALD Ag films deposited at 120 and 200 °C. Compared to W surface, where poor adhesion of the films was found, Co, Ni, TiN, Ti/TiN and SiO2 surfaces had better adhesion for silver films as revealed by SEM, TEM, and AFM images.