In spite of a high market share of plastic IC packaging, there are still reliability issues, especially for the effects of moisture. The mechanism between moisture and epoxy polymer is still obscure. A multi-step cross-linking approach was used to mimic the cross-linking process between the DGEBA resin and JEFFAMINE®-D230 agent. Based on the molecular dynamics method, the thermo-mechanical properties and microstructure of epoxy polymer were analyzed. In this paper, the degree of cross-linking ranged from 0% to 85.4% and the moisture concentration ranged from 0 wt.% to 12 wt.%. The hydrogen bonds were investigated in the moisture invaded epoxy polymer. Although most of the hydrogen bonds were related to water molecules, the hydrogen bonds between the inside of epoxy polymer were reduced only a little as the concentration of moisture increased. The diffusion coefficient of the water molecules was found to increase with the increase of moisture concentration. When the moisture concentration was larger than 12 wt.% or smaller than 1.6 wt.%, the diffusion coefficient was less affected by the epoxy polymer. In addition, the free volume and the thermal conductivity of the epoxy polymer were considered. It was found that the moisture could increase the thermal conductivity from 0.24 to 0.31 W/m/K, identifying a coupling relationship between moisture and thermal properties. Finally, the mechanical properties of epoxy polymer were analyzed by uniaxial tensile simulation. The COMPASS and DREIDING force fields were used during the uniaxial tensile simulation. A better result was achieved from the DREIDING force field compared with the experiment. The degree of cross-linking was positively correlated with mechanical properties. For the system with the largest degree of cross-linking of 85.4%, the Young’s modulus was 2.134 ± 0.522 GPa and the yield strength was 0.081 ± 0.01 GPa. There were both plasticizing and anti-plasticizing effects when the water molecules entered the epoxy polymer. Both the Young’s moduli and yield strength varied in a large range from 1.38 to 2.344 GPa and from 0.062 to 0.128 GPa, respectively.

Optically clear adhesive (OCA) has been widely used in flexible devices, where wavy stripes that cause troublesome long-term reliability problems often occur. The complex mechanical behavior of OCA should be studied, as it is related to the aforementioned problems. Therefore, it is necessary to establish reasonable mechanical constitutive models for deformation and stress control. In this work, hyperelastic and viscoelastic mechanical tests were carried out systematically and relative constitutive models of OCA material were established. We found that temperature has a great influence on OCA’s mechanical properties. The stress and modulus both decreased rapidly as the temperature increased. In the static viscoelasticity test, the initial stress at 85 °C was only 12.6 kPa, 57.4% lower than the initial stress at 30 °C. However, in the dynamic test, the storage modulus monotonically decreased from 1666.3 MPa to 0.6628 MPa as the temperature rose, and the decline rate reached the maximum near the glass transition temperature (Tg = 0 °C). The test data and constitutive models can be used as design references in the manufacturing process, as well as for product reliability evaluation.

No abstract

In this paper, we study the effects of the elasticity and proximity of a circular inclusion upon the fracture angle of a bent crack in the surrounding matrix. The medium is assumed to be in plane strain, and loaded in uniaxial tension by stresses acting perpendicular to the main branch of the crack. A comparison is made of fracture-angle predictions based upon current theories governing the initial fracture angle.

No abstract