No abstract

No abstract

Recent advances in smartphone technologies have opened the door to the development of accessible, highly portable sensing tools capable of accurate and reliable data collection in a range of environmental settings. In this article, we introduce a low-cost smartphone-based hyperspectral imaging system that can convert a standard smartphone camera into a visible wavelength hyperspectral sensor for ca. £100. To the best of our knowledge, this represents the first smartphone capable of hyperspectral data collection without the need for extensive post processing. The Hyperspectral Smartphone’s abilities are tested in a variety of environmental applications and its capabilities directly compared to the laboratory-based analogue from our previous research, as well as the wider existing literature. The Hyperspectral Smartphone is capable of accurate, laboratory- and field-based hyperspectral data collection, demonstrating the significant promise of both this device and smartphone-based hyperspectral imaging as a whole.

Accurate quantitative temperature measurements are difficult to achieve using focal-plane array sensors. This is due to reflections inside the instrument and the difficulty of calibrating a matrix of pixels as identical radiation thermometers. Size-of-source effect (SSE), which is the dependence of an infrared temperature measurement on the area surrounding the target area, is a major contributor to this problem and cannot be reduced using glare stops. Measurements are affected by power received from outside the field-of-view (FOV), leading to increased measurement uncertainty. In this work, we present a micromechanical systems (MEMS) mirror based scanning thermal imaging camera with reduced measurement uncertainty compared to focal-plane array based systems. We demonstrate our flexible imaging approach using a Si avalanche photodiode (APD), which utilises high internal gain to enable the measurement of lower target temperatures with an effective wavelength of 1 µm and compare results with a Si photodiode. We compare measurements from our APD thermal imaging instrument against a commercial bolometer based focal-plane array camera. Our scanning approach results in a reduction in SSE related temperature error by 66 °C for the measurement of a spatially uniform 800 °C target when the target aperture diameter is increased from 10 to 20 mm. We also find that our APD instrument is capable of measuring target temperatures below 700 °C, over these near infrared wavelengths, with D* related measurement uncertainty of ± 0.5 °C.