A chitinase- and protease-producing bacterium was isolated and identified as Bacillus cereus TKU006. The better condition on our tests for protease and chitinase production was found when the culture was shaken at 25 degrees C for 2 days in 25 mL of medium containing 2% shrimp shell powder (w/v), 0.1% K(2)HPO(4), and 0.05% MgSO(4).7H(2)O. The molecular masses of TKU006 protease and chitinase determined by sodium dodecyl sulfate (SDS)-polyacrylamide gel electrophoresis were approximately 39 and 35 kDa, respectively. The optimum pH, optimum temperature, pH stability, and thermal stability of TKU006 protease and chitinase were 9, 50 degrees C, 3-11, 50 degrees C and 5, 40 degrees C, 3-11, 60 degrees C, respectively. TKU006 protease was inhibited completely by EDTA, indicating that the TKU006 protease was a metalloprotease. The TKU006 protease and chitinase retained 61%, 60%, 73%, and 100% and 60%, 60%, 71%, and 96% of its original activity in the presence of 2% Tween 20, 2% Tween 40, 2% Triton X-100, and 1 mM SDS, respectively. The antioxidant activity of TKU006 culture supernatant was determined through the scavenging ability on DPPH with 70% per milliliter. In conclusion, the novelties of the TKU006 protease and chitinase include its high stability to the surfactants and pH. Besides, with this method, we have shown that marine wastes can be utilized to generate a high-value-added product and have revealed its hidden potential in the production of functional foods.

In this paper, we focus on how to identify the influence of device cause by substrate damage issue via nanoprobing analysis, and inferring that the equivalent mathematical models was application to describe the corresponding electrical data in a device with substrate damage issue.A case study was presented to verify that poor Poly etching process control caused substrate damage issue, and this issue can be identified via physical failure analysis (PFA) method (e.g. Transmission Electron Microscope (TEM) and Focus Ion Beam (FIB) techniques) and nanoprobing analysis method.

Using nanoprobing techniques to accomplish transistor parametric data has been reported as a method of failure analysis in nanometer scale defect. In this paper, we focus on how to identify the influence of Contact high resistance on device soft failures using nanoprobing analysis, and showing that the equivalent mathematical models could be used to describe the corresponding electrical data in a device with Contact high resistance issue. A case study was presented to verify that Contact volcano defect caused Contact high resistance issue, and this issue can be identified via physical failure analysis (PFA) method (e.g. Transmission Electron Microscope and Focus Ion Beam techniques) and nanoprobing analysis method. Finally, we would explain the physical root cause of Contact volcano issue.