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In this paper, we propose a simple trench-oxide thin-film transistor (TO TFT) process for 1T-DRAM applications. Our proposed TO TFT structure has several novel features as follows: 1. The buried oxide and the isolation oxide are carried out simultaneously in order to achieve a goal of simple process. 2. The trench design is used to improve both the sensing current windows (~ 84%) and the retention time (~ 57%). 3. The thermal stability is drastically improved by its naturally formed source/drain tie. The above mentioned features help our proposed device structure to demonstrate the desired characteristics that are better than that of a conventional TFT. Additionally, the thermal instability is drastically improved which is good for long-term device operation.

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We present a new vertical sidewall MOSFET with embedded gate (EGVMOS) to reduce the parasitic capacitance which is the major disadvantage in a conventional VMOS. According to simulations, our EGVMOS can not only achieve about 86.34% and 54.76% reduction at Cgd at VDs = 0.05 V and 1.0 V respectively, but also improves the device reliability due to suppressed kink effects, in comparison with a conventional VMOS.