No abstract

CSP (Chip scale package) LEDs have drawn intensive attention lately since it provides multiple times power density than traditional packages. Higher power density brings possibilities of better light control and more industrial applications in UV LED applications. Therefore, a chip scale LED package of 2.0 x 1.6 mm, named 2016, has been designed and fabricated for UV applications. The LED package is fabricated by dispensing highly thixotropic encapsulant to form a encapsulation layer. It's cost-effective and brief in production flow. In this paper, an optical model of 2016 LED package with a dispensed encapsulation layer is constructed for analysis. Variables including encapsulant height are studied by optical simulations. In order to validate the 2016package with production deviations, ray files of the resulting packages are then applied to a three-row silica collimator for high irradiance UV LED module as a test vehicle. After intentional designing for the manufacture window in production, total flux decreases by 5% and peak irradiance decreases by 3% even in the corner case with SMT deviations in the collimator. It then leads to a conclusion that 2016 UV LED with dispensed encapsulant could be applied to UV curing applications well.