Fan-out wafer-level packaging (FOWLP) is an interesting platform for Microelectromechanical systems (MEMS) sensor packaging. Employing FOWLP for MEMS sensor packaging has some unique challenges, while some originate merely from the fabrication of redistribution layers (RDL). For instance, it is crucial to protect the delicate structures and fragile membranes during RDL formation. Thus, additive manufacturing (AM) for RDL formation seems to be an auspicious approach, as those challenges are conquered by principle. In this study, by exploiting the benefits of AM, RDLs for fan-out packaging of capacitive micromachined ultrasound transducers (CMUT) were realized via drop-on-demand inkjet printing technology. The long-term reliability of the printed tracks was assessed via temperature cycling tests. The effects of multilayering and implementation of an insulating ramp on the reliability of the conductive tracks were identified. Packaging-induced stresses on CMUT dies were further investigated via laser-Doppler vibrometry (LDV) measurements and the corresponding resonance frequency shift. Conclusively, the bottlenecks of the inkjet-printed RDLs for FOWLP were discussed in detail.

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An analytical model is presented that describes the acoustical impedance of cylindrical tubes and concentrically connected systems of such tubes valid up to the ultrasonic application. This allows the evaluation of microsized geometries encountered in acoustical microdevices, such as housing enclosures and sound port Helmholtz resonators. Each tube is treated as an acoustic transmission line (TL). Connected tubes are described using a coupling impedance, which accounts for viscous and inertial effects due to duct size changes. The acoustic TL model is directly derived from Navier-Stokes and energy equation, including frequency dependent boundary layer effects of the viscous and thermal dissipation. The results for various evaluated enclosure and resonator geometries are in good agreement with finite element method (FEM) simulation in both audio and ultrasonic frequency range and are compared to dedicated lumped element models referenced in literature. The presented model provides benefits in three ways: it is faster than FEM simulation and allows an implementation into analytical models and circuit simulation tools. Finally, it allows geometries with characteristic dimensions close to and above the wavelength to be treated with high precision in contrast to lumped element models.

The large-scale production of large-format Li-ion batteries is a challenging topic for suppliers of materials and components as well as for manufacturers of battery cells. Particularly, the formation and electrical testing of individual battery cells - the last steps of the production line - are identified as a significant bottleneck for mass production. Thus, detailed studies on end-of-line testing and formation were carried out to develop efficient test procedures and parameter extraction regarding cell quality monitoring

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